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SMTA Announces 2005 Pan Pacific Symposium Best Paper Award
March 1, 2005 |Estimated reading time: 1 minute
MINNEAPOLIS — As speakers at SMTA's Tenth Annual Pan Pacific Microelectronics Symposium (held January 25-27, 2005, in Kauai, Hawaii), individuals promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. As rated by the attendees, the Best Paper award was presented to Alan Rae of NanoDynamics, Inc.
In his paper, entitled, "Nanotechnology and Low Temperature Electronics Assembly," Rae reviews "concerns among board assemblers that some components are not—and will not—be ready for 100% lead-free assembly. In addition, assemblers of 'exempt' boards serving the military, aerospace, and automotive industries are finding that lead-containing components may no longer be available and will force conversion of these complex boards."
He goes on to discuss how nanotechnology enables a number of tools which will allow lower-temperature assembly through enhanced solders, adhesives and novel attachment methods.
Rae's paper is currently featured in the 2005 Pan Pacific Symposium Proceedings, available in the SMTA Bookstore and shortly in the Knowledge Base at www.smta.org. For more information on the Pan Pacific Microelectronics Symposium and Exhibit, contact JoAnn Stromberg at (952) 920-7682 or joann@smta.org. Developing details regarding the Annual Symposium can be found on the Pan Pacific event Website at www.smta.org/pan_pac.