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Lead-free Workshop to Provide Hands-on Training
February 9, 2005 |Estimated reading time: Less than a minute
SAN DIEGO — KIC will co-sponsor a lead-free workshop, to be held March 16-17, at the Engent facility in Norcross, Ga. The workshop also involves experts from Engent, Henkel Technologies, Siemens Dematic, Cogiscan and Speedline Technologies.
This two-day training program will provide participants with a broader knowledge of lead-free materials interactions, and a greater understanding of the process, including advantages and limitations. Each attendee will take away a sample lead-free board manufactured over the two days, and engineering and technical representatives will be available for one-on-one discussion.
A panel of industry experts will discuss the following:
*Dr. Neil Poole of Henkel Technologies will present on alloy reliability, material interactions, surface mount adhesives, underfills and conformal coatings.
*Dr. Daniel Baldwin of Engent will discuss process engineering methods, analytical tools and design of experiment (DOE).
*Francois Monette of Cogiscan Inc. will present on material logistics and identification, component compatibility, and the impact on moisture-sensitive devices (MSD).
*Marybeth Allen of KIC will discuss management of the thermal processes as they relate to the conversion to lead-free manufacturing.
*Keith Howell of Speedline Technologies will present on wave and reflow processes.
For additional information and a detailed agenda, please visit www.kicthermal.com/index.html.