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Integrated Process Assembly Cell Increases Productivity
February 4, 2005 |Estimated reading time: Less than a minute
ELGIN, Ill. — The Integrated Process Assembly Cell (IPAC) from Panasonic Factory Solutions Company of America combines high-volume manufacturing and microelectronics into one cell. Primarily comprised of die attach/flip chip, chip shooter, odd form and dispenser modules, IPAC is designed to build smaller packages and circuits, such as SiPs, with mixed technology and high density.
Each module features a 940-mm standard frame width, increasing output per sq. ft. and allowing for better area productivity. It is upgradeable for future requirements, and features common spare parts and operator interfaces. Dual lanes and dual-gantry robot heads on similar X-Y planes reduce wait time.