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IPC Holds First Standards Meeting in Dongguan
January 24, 2005 |Estimated reading time: 1 minute
BANNOCKBURN, Ill. — More than 15 companies gathered for the first IPC standards meeting in China sponsored by IPC—Association Connecting Electronics Industries. The meeting, held in conjunction with the IPC and Hong Kong Printed Circuit Association (HKPCA) trade show, took place on December 10, 2004 in Dongguan.
Participants were presented with an overview of IPC's standards development and revision process by David Bergman, IPC's VP of standards, technical and international relations, U.S., and Leesha Peng, IPC's director of technical programs, China. The group also discussed committee history, structure and comment cycles.
Discussions then turned to standards of interest, including IPC-A-600, Acceptability of Printed Boards; IPC-A-610, Acceptability of Electronic Assemblies (available in Chinese); and IPC-J-STD-001, Requirements for Soldered Electrical & Electronic Assemblies (Chinese translation available soon), which are three of IPC's most widely used standards. Meeting attendees also expressed interest in having IPC-T-50, a terms and definitions document translated.
The opportunity to provide comments on proposed standards was another item of interest amongst participants, and ways to submit comments was discussed at length. The group recognized the fact that they could not attend many standards meetings, so they proposed meeting locally to develop comments and submit them to the appropriate development committee. This suggestion will be implemented by the summer of 2005.
Technology tools and the creation of a peer-to-peer e-mail forum in simplified Mandarin, as well as a standards group mail box for communication between task group members was also proposed. IPC staff will look into developing these technology tools and provide a status update at the next standards meeting in China.
For more information on standards activities in China, contact Bergman at (847) 597-2840 or at davidbergman@ipc.org.