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NPL Conference Concentrates on Lead-free Solder Reliability
January 21, 2005 |Estimated reading time: 1 minute
TEDDINGTON, MIDDLESEX, U.K. — At their Winter Conference, NPL's Soldering Science & Technology Club included an update on RoHS from the Department of Trade and Industry (DTI), plus invited presentations on the latest research from the Swedish Institute of Metals Research, Loughborough and Greenwich University. In addition, the most recent research from DTI-funded projects at NPL was presented.
In the RoHS Overview and Update, James Lidgard from DTI stated, "Our view of the compliance and enforcement regime has not changed from that set out in the DTI's non-statutory draft RoHS guidance document, which was published as part of the last WEEE/RoHS consultation in July [2004]."
"The U.K. intends to accept self-declaration as the basis of the compliance regime. Any item of electrical or electronic equipment (EEE) placed on the market will be assumed to comply with the RoHS Regulations. The enforcement authority will carry out market surveillance and may challenge any producer that it suspects of placing non-compliant EEE on the market. A defense of 'due diligence' will be available where the producer can show that all reasonable steps were taken to avoid committing an offense. This may include reference to an act or default, or information given by a third party."
The remaining program, chaired by Jim Vincent of Bookham Technology, included:
"Measuring Tin Whiskering Propensity with XRD," Chris Hunt, NPL
"Fatigue Properties of Sn3.5Ag0.7Cu Solder Joints and Effects of Lead contamination," James Oliver, SIMR
"Overmolding of Electronics with Recyclable Polymers," David Whalley and David Hutt, Loughborough University
"Effect of Microstructure, PCB Finish and Processing on LF Reliability," Milos Dusek, NPL
"Measuring Voiding Levels in a range of Lead-free Solder Pastes," Martin Wickham, NPL
"The Compatibility of Lead-free Solder with Different Metallization," James Oliver, SIMR
"Lead Distribution in Contaminated LF Joints and Studio Update," Martin Wickham, NPL
"A New Test Method for Lead-free Solder Joint Reliability," Milos Dusek, NPL
"Modeling New Damage Mechanisms for Lead-free Solders," Chris Bailey and Steve Rideout, Greenwich University.