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UV-cure Encapsulants for Smart Card ICs Released
January 13, 2005 |Estimated reading time: Less than a minute
CITY of INDUSTRY, Calif. — Hysol 3323, Hysol 3327 and Hysol 3329 UV-cure encapsulants for use in Smart Card IC module manufacturing are now available from Henkel Technologies. Hysol 3323 has high viscosity and a thixotropic nature, and is used to form the dam, while Hysol 3327 and 3329 are both low-viscosity materials used for the fill process.
Hysol 3329 has a higher Tg of 155°C, when compared to 110°C for Hysol 3327, and a higher Shore hardness. Either combination will pass mechanical stress testing and high-reliability tests, typically -55°C to 125°C temperature cycling, heat/humidity aging at 85°C and 85% relative humidity.
These encapsulants facilitate dispensing, adhere strongly to commonly-used carrier substrates and possess a low coefficient of thermal expansion (45 ppm below Tg, and 130 ppm above Tg). Typical UV cure times per IC module are between 26-46 sec., enabling a maximum of 10,000 UPH with no post-cure requirement.