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Speedline to Present Papers, Programs and Seminars at APEX 2005
December 31, 1969 |Estimated reading time: 1 minute
Speedline Technologies will present several important technical papers and training programs, as well as host a series of informative seminars at APEX 2005, to be held February 22-24, 2005, in Anaheim, Calif.
Speedline's technical paper titles and presenters are as follows:
"Affects of Cooling Slopes in Lead-Free Reflow," to be presented by Marc Apell, product marketing manager; Tad Formella, applications engineer; and Rich Burke, sales engineer;
"Bridge Vision: An Analysis of Bridge Defects in the Solder Past Printing Process," to be presented by David Prince, senior engineer, Advanced Development;"Practical Lead-free Assembly," to be presented by Joe Belmonte, senior process engineer, Advanced Process Group;"Fluxing Effects in Lead-free Wave Soldering," by Ken Kirby, applications engineer, and Keith Howell, product marketing manager.
Additionally, Speedline will present the following training programs at APEX 2005:"Practical Lead-free Program," a full-day training seminar, to be presented by Joe Belmonte, senior process engineer and Marc Apell, product marketing manager;"Pin-in-paste Process," a half-day training seminar, to be presented by Joe Belmonte, senior process engineer.
As of February 28, 2005, abstracts and complete copies of the technical papers will be available at www.speedlinetech.com/apex2005abstracts. Copies may also be requested by calling (508) 541-4749 or e-mailing ecandela@speedlinetech.com.
Speedline will also host a series of free technical seminars focused on the leading SMT manufacturing process challenges of 2005. The one-hour seminars will be hosted throughout APEX at the Speedline exhibit, booth #1227. Joe Belmonte, project manager, Advanced Process Group, will lead the events. The schedule is as follows:Tuesday, February 22 12 p.m.: Lead-free 2 p.m.: U.S. Competitiveness 4 p.m.: Defect-free Printing
Wednesday, February 23 1 p.m.: Lead-free 3 p.m.: U.S. Competitiveness 5 p.m.: Defect-free Printing
Thursday, February 24 11 a.m.: Lead-free 12 p.m.: Defect-free Printing