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Packaging Technologies Challenge Inspection Market
December 14, 2004 |Estimated reading time: Less than a minute
Palo Alto, Calif. — The widespread use of packaging technologies, such as CSP and BGAs in electronics manufacturing, makes it vital for inspection system companies to realign their product development strategy to keep pace with such sophisticated technology.
New analysis from the Frost & Sullivan (www.testandmeasurement.frost.com) World Vision and X-ray Inspection Systems in Electronics Manufacturing Market reveals that the market was worth $499.0 million in 2003, and expects to reach $891.3 million in 2010.
If an analysis which provides manufacturers, end users and other industry participants with an overview, summary, challenges and latest coverage of the World Vision and X-ray Inspection Systems in Electronics Manufacturing Market sounds interesting, then send an e-mail to Natalie Benavides, North American Corporate Communications, at natalie.benavides@frost.com with the following information: full name, company name, title, contact telephone number, contact fax number and e-mail. Upon receipt of the above information, an overview will be e-mailed.