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Embedded Passive NPL Masterclass Well Received
December 9, 2004 |Estimated reading time: 1 minute
Teddington, Middlesex, U.K. — At the recent National Physical Laboratory (NPL) Masterclass, part of the ongoing series inviting world-class presenters to Teddington, Dr. Richard Ulrich, author of the book, "Integrated Passive Component Technology," gave a comprehensive discourse on the current and future benefits of embedded passives.
A major driver today for embedded passives is the need for decoupling; currently, many discreet capacitors are arrayed around microprocessors taking up PCB area and adding inductance. Guidance on potential benefits and design criteria were discussed. Ulrich reported a major hurdle to be overcome is with material developments and the incorporation of embedded passive features into PCB design software, and for PCB shops to take on board the necessary fabrication facilities.
Ulrich outlined the types of products that currently feature embedded technology; many are household names and have used these materials for the last five years. It is also interesting that the use of printed resistors will be one of the technologies to be adopted; it is simple, cost-effective and there is a great deal of process knowledge in the printed board industry. Printed polymer inks have been in use for the last 20 years in different applications and go in and out of favor.
Embedded components will have an impact on board technology, but also on SMT component placement; fewer parts to place means faster throughput speed in production and less passive parts on the surface of the board. This leaves more room for the design engineer to include more active circuitry.
Dr. Ulrich is located at the High Density Electronics Center, University of Arkansas, and is a member of the National Electronics Manufacturer's Institute (NEMI) Committee on Future Technologies.