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Endicott Interconnect Technology Receives Second Issued Patent
December 3, 2004 |Estimated reading time: Less than a minute
Endicott, N.Y. — Engineers at Endicott Interconnect (EI) Technology didn't skip a beat when the company formed in 2002. The flow of innovative ideas and patent applications continued unabated. Because of this, Endicott has recently received its second issued patent.
In late October 2004, EI received their first U.S. Patent (6,809,269) "Circuitized Substrate Assembly and Method of Making Same," a multilayer printed circuit which utilizes conductive paste to form electrical connections between layers of the structure. This was followed quickly with a second U.S. patent, 6,815,837, titled, "Electronic Package with Strengthened Conductive Pad," an approach to strengthening the design of printed circuits to improve their reliability when assembled with components. The two patents cover technologies EI developed to enable their customers to push the limits of circuit density and performance, while maintaining quality and reliability.