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DEK Reveals Findings from U.K. Stencils Technology Day
December 2, 2004 |Estimated reading time: Less than a minute
Weymouth, U.K. — DEK held a Stencils Technology Day at its Weymouth, U.K. office on November 25 to share the findings from its recent lead-free print trials, and provide hands-on experience of stencil technologies and their applications.
The main event was the presentation of the results of DEK's lead-free trials by Clive Ashmore, global applied process manager. The key conclusion was that having a stencil which is well-designed and specified for its application has the greatest impact on process performance, whether the application is lead-free or leaded. Materials composition was shown to be a secondary element. Electroformed nickel was the top performing stencil material in tests, closely followed by laser-cut nickel.
This was followed by a look at lead-free requirements from a pastes point of view, presented by Richard Boyle of Henkel Multicore, which focused on areas where the differences between leaded and unleaded may impact the industry the most.
The afternoon was dedicated to workshops and discussions on the theme, "Print Failures: Cause and Effect." These gave participants the opportunity to share experiences and ideas, and gain hands-on practice of leading-edge technologies, including lead-free processes and ProFlow; adhesive printing and PumpPrint; additive/step-etched stencil technology and ball placement.