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SMTA Announces Call for Papers for SMTAI 2005
November 19, 2004 |Estimated reading time: 1 minute
Minneapolis, Minn.—The SMTA International Technical Committee is announcing the Call for Papers for SMTA International 2005, to be held September 25-29, 2005, at the Donald E. Stephens Convention Center in Rosemont, Ill.
Abstract Deadline: February 7, 2005
Acceptance: April 15, 2005
Manuscripts Due: July 22, 2005
Papers should describe significant results from experiments, emphasize new techniques and contain technical, economic or appropriate test data. Material should be original, unpublished and non-commercial in nature.
Papers are being solicited in the following categories:
Emerging Technologies: "New Materials and Processes," "Consumer Applications," "System in a Package," "MEMS/MOEMS," "Optoelectronics," "Wireless Applications including Bluetooth and Wi-Fi," "Nanotechnology," and "0201 Components, Assembly, and Getters."
Components: "BGA," "Battery Interactions," "CSP including Wafer-Level Packages," "Component Solderability," "Component Reliability," "Connectors," "Embedded Passives," "Failure Analysis," "Fine-pitch Technology," "Flip Chip/Direct Chip Attach," "Harsh Environments (automotive, military, space)," "Lead/Termination Finish," "Leadless Packaging," and "Multichip Packages including 3-D Packaging."
Assembly: "Adhesives," "BGA/CSP Assembly," "Cleaning," "Connector Technology," "DFX/Design for Six Sigma," "Dispensing," "Equipment Selection," "Facility Layout," "Flux and Solder," "Land Pattern Design," "Lead-free Soldering (including case studies)," "Lean Manufacturing," "Low Volume/Prototype Assembly," "Medical Electronics," "Moisture Sensitivity," "Placement," "Printing," "Reflow Soldering," "Rework and Repair," "Selective Soldering," "Setup Reduction," "Solder Paste," "Supplier Engineering," "Wave Soldering," and "Yield Improvement."
PCB Technology: "Black Pad," "Embedded Passive and Active Components," "HDI," "Microvias (filled and unfilled)," "Soldermask," "Substrate Reliability," "Substrate Solderability," and "Surface Finish."
Process Control: "AOI," "CIM," "In-circuit Test," "Process Modeling," "Software," "Test Strategies" and "X-ray."
Business: "Capacity Modeling," "Contract Manufacturing," "Doing Business in Asia," "Environmental Issues," "Lean Manufacturing/Quality Initiatives," "Operations Management," "Remaining Competitive," "RoHS Compliance," "Supplier Management" and "Technology Roadmaps."
Please submit abstracts online at: http://www.smta.org/smtai/call_for_papers.cfm.