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IPC Releases New Revisions through Dynamix Technology
October 27, 2004 |Estimated reading time: 2 minutes
Kidlington, Oxfordshire, U.K.—The IPC has released Revision B to IPC-6012, Qualification and Performance Specification for Rigid Printed Boards, and Revision G to IPC-A-600, Acceptability of Printed Boards. Together, they represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards and the frequency of end-product inspections. These are now available through Dynamix Technology.
There is a close relationship between the two documents. IPC-A-600 relies on IPC-6012 for the minimum acceptability requirements for printed boards and the acceptance testing frequencies required for printed board manufacture and procurement, and IPC-6012 relies on IPC-A-600 for visual support and interpretation of those requirements.
Revision G of IPC-A-600 incorporates over 80 new or revised graphics and photographs to better illustrate acceptance criteria within IPC-6012. Existing sections, such as those for measles, dewetting, conductor width, etchback and foil cracks, have been updated with new or enhanced images. The document has been updated to better define the concept of thermal zones for evaluation of laminate voids, and definitions for internal and external annular ring have also been revised. Where possible, illustrations have been replaced with photographs to better describe IPC-6012 requirements. New sections have also been created to address lifted lands prior to thermal stress, smear removal resulting from plated through-hole formation and surface plating requirements for wire-bond pads.
IPC-A-600G flex and rigid-flex board performance criteria has been updated to match the criteria established in IPC-6013A, Qualification and Performance Specification for Flexible Printed Boards. Previous versions of IPC-A-600 lacked strong coverage of IPC-6013 performance criteria. Illustrations and photographs have been incorporated or updated to address coverlayer coverage, adhesive squeeze-out for both lands and foil surfaces, access hole registration, and laminate integrity for both flexible and rigid-flex printed boards.
A significant number of changes can be found in Revision B to IPC-6012. Acknowledging advances in surface finishes and hole densities, tables describing minimum plating thicknesses have been updated to address nickel under gold for wire-bond applications, electroless nickel/immersion gold (ENIG) and microvia structures. Coverage of defects within solderable lands has been expanded to address BGA pads and wire-bond pads, as well as more detailed requirements for rectangular surface-mount pads. A new section has also been created that discusses hole size, hole pattern accuracy and pattern feature accuracy. An important addition to the section on internal annular ring requirements provides guidance on the issue of whether or not misregistration can accurately be evaluated, based on how a microsection cut is "clocked" or rotated.
IPC-6012B also unveils a performance specification slash sheet for space and military avionics. Based on existing OEM industry specifications, this specification sheet provides exceptions to IPC-6012B Class 3 requirements for use by the aerospace and military avionics sector of the electronics interconnect industry.