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New Global Platform Price Reductions from Universal
October 8, 2004 |Estimated reading time: 1 minute
Binghamton, N.Y.—Placement equipment specialist and line solution provider, Universal Instruments, has announced a significant price reduction across its best-in-class platform product ranges in all geographic regions, effective immediately. The objective is to offer customers highly competitive and identical prices around the world.
Universal is the first placement equipment vendor to achieve global price consistency. This simplifies the purchasing process for multi-national customers, while the aggressive price reduction on the company's AdVantis and Genesis platforms benefits all customers.
These new and highly competitive prices for the platforms include:
*Genesis Flexible Fine Pitch (FFP), a twin-beam modular chip placer combined with high-speed FFP capability from $239k to $259k.
*Genesis High Speed Chip (HSC), with twin beams and two Lightning heads for speeds up to 54,000cph for $299k.
*AdVantis Flexible Fine Pitch (FFP), a single-beam chip placer with FFP capability for $125k.
*AdVantis High Speed Chip (HSC); with a Lightning head for speeds up to 30,000cph for $150k.
The new prices mean that High Speed Chip (HSC) and Flexible Fine Pitch (FFP) Platform customers can now enjoy Universal Instruments' celebrated equipment robustness, reliability and technology advancements for less. The company's track record of high intrinsic availability is clearly proven by years of uptime in diverse manufacturing environments around the world. In addition, the new Lightning head deployed in HSC platform configurations is clear evidence of Universal Instruments' technology development proficiency. The initiative is a milestone in the corporation's quest to become the equipment manufacturer with the lowest costs and broadest range, allowing it to deliver unbeatable value. The new aggressive global pricing has been made possible by Universal's continuing policy of driving out costs from all its processes, including mandates to design out cost during product development cycles, supply chain optimization with global sourcing and a broadened manufacturing base.
"Our 'cost-down' initiatives have been a huge success, and we're able to pass the savings on to our customers, with a worldwide, across-the-board platform price reduction," says Gene Heiser, Universal's VP of sales and marketing. "We have succeeded in streamlining every part of our operation, securing profitability and boosting customer value, without compromising quality, and that is now translating directly to new lower platform prices."