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New Products
December 31, 1969 |Estimated reading time: 4 minutes
ASSEMBLY TOOLS & EQUIPMENT
Air-Operated PunchN200 top-down, air-operated punch is said to singulate tab-routed PCB panels one tab at a time. An upper and lower matching knife blade pinches the tabs apart, reportedly producing less stress on the PCB than a punch and die because the cutting action takes place from both sides. The standard die set cuts a single tab, and the tab is positioned on the lower knife by placing the routed section of the panel on a set of locating pins. This holds the PCB or lets it rest on the support table. Its exact cutting location is adjustable by turning a screw, bringing the locating pins to the desired place for cutting a tab. FKN Systek, Framingham, Mass.
DISPENSING EQUIPMENT
Transfer/Metering SystemTitan PF material supply system is said to use progressive, cavity-metering pump technology to transfer filled, abrasive and shear-sensitive materials from one-gallon shipping containers to dispense valves. It includes a one-gallon follower plate, dual-air cylinder ram, and an AC brushless motor and controls. The system can be integrated with automated equipment to apply thermally conductive materials. It is available in a range of progressive cavity metering pump diameters to meet application flow rate requirements. Liquid Control Corp., North Canton, Ohio
Fluid Dispensing SystemDispenseJet DJ-9000 fluid dispensing system is said to shoot a fluid stream of underfill adhesive as small as 100 micrometers wide between the solder balls on CSPs and other BGA packages during the packaging process. Other methods of pre-applied underfill reportedly result in contamination of the solder balls. Jetting the underfill prior to board assembly without contaminating the solder balls is said to allow for improved reliability without the cost of traditional underfilling. The cured reinforcement material relieves stress at the ball-substrate interface by reducing the geometric stress concentration factor at that point. Therefore, the solder joint withstands more load during shock-loading or thermal cycling. Asymtek, Carlsbad, Calif.
HARDWARE
Surface Mount FuseUSF 1206 lead-free surface mount fuse is said to have an interrupt rating of 50 A at 63 V DC across the entire range. The thin-film chip fuse also reportedly features low-voltage drop and power dissipation ratings, providing performance in dense circuits. Its quick-acting tripping time is suited for sensitive electronic devices that require reliable, overcurrent protection. A legend marking provides visible indication of the fuse's A rating. The fuse measures 1.6 mm in length, 3.20 mm in width, and 0.6 mm in height; is built according to UL 248-1; and is cURus approved. Resistance to soldering heat is 260°C/10 sec according to IEC 60068-2-58 and 260°C/30 sec for MIL-STD-202, Method 210. Operating temperature is -55 to 90°C. Schurter Inc., Santa Rosa, Calif.
MATERIALS
Thermal Interface MaterialLoctite Powerstrate Xtreme is said to be a reworkable, phase-change thermal interface material (TIM) targeted for use between a heat sink and a variety of heat-dissipating components. Upon flow, air is expelled from the interface, thermal impedance is re-duced, and the material performs as a TIM. It adheres to heat sinks and devices at room temperature, improving throughput and lowering assembly and energy costs. This TIM is targeted for use as a replacement for thermal grease between processors, MCMs and ASICs and their active heat sinks. Henkel Technologies, City of Industry, Calif.
EpoxyEP42HT-2 room-temperature curing, two-component epoxy adhesive, sealant, coating and casting material is said to feature both high-temperature and chemical resistance. It features a 100:40 mix ratio by weight or a 100:50 mix ratio by volume, a mixed viscosity of 3,500 cps, and casts in thicknesses exceeding 2 to 3". Its service operating temperature range is -60° to 450°F. The material features resistance to inorganic and organic acids, alkalis, organic solvents, and aromatic hydrocarbons. EP42HT-2's tensile strength is >450,000 psi, its Shore D hardness is >75 and its volume resistivity is >1014 Ωcm. Master Bond Inc., Hackensack, N.J.
PASSIVE COMPONENTS
Surface Mount CapacitorsHi-Q Series MLC surface mount power capacitors are said to handle high power and high voltage levels for RF applications, and feature an ultra-low equivalent series resistance (ESR) and dissipation factor at high frequencies. They are designed for 600 to 4,000 V applications and feature a dielectric strength of 120 percent of rated WVDC. Their capacitance values range from 10 to 6,800 pF with tolerances to ±20 percent, and operate over temperatures from -55° to 125°C. AVX Corp., Myrtle Beach, S.C.
Infrared EmittersFamily of high-speed, infrared emitters is said to offer high levels of radiant power and intensity. The TSFF5410 emitter combines a ±22° angle of half intensity with radiant intensity of 70 mW/sr, while the TSFF5210 combines a ±10° angle of half intensity with radiant intensity of 180 mW/sr. They both feature a high-modulation bandwidth of 23 MHz and a rise/fall time of 15 ns. The TSMF4710 and TSMF3710 both offer a 60° angle of half intensity with typical radiant intensity of 10 mW/sr, 23-MHz modulation bandwidth, and a 15-ns rise/fall time. Vishay Intertechnology Inc., Malvern, Pa.
PICK-AND-PLACE EQUIPMENT
Placement MachineQuadris placement machine is said to achieve 62,000-cph placement speed within a small footprint for concentrated throughput in a four-gantry system. This hybrid, four-beam SMT placement system reportedly incorporates both turret-style and overhead gantry technologies, delivering 62,000-cph placement performance courtesy of dual-drive linear motors. Quadris also features automatic placement height optimization through on-the-head CCD linear sensors and patented, 12-spindle direct-drive heads. Universal Instruments Corp., Binghamton, N.Y.
TEST & INSPECTION
Automated Optical Inspection SystemYTV-1000 tabletop AOI system is said to provide automated advanced inspection of solder and lead defects, component presence and position, correct part, polarity, and through-hole parts for improved quality and increased throughput. The system also provides complete inspection coverage with a low false failure rate, using new image processing technology that integrates several techniques to include color, normalized correlation and rule-based algorithms. YESTech, San Clemente, Calif.