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MEPTEC Symposium to Focus on Industry Advancements
September 28, 2004 |Estimated reading time: Less than a minute
Mountain View, Calif. — The MicroElectronics Packaging and Test Engineering Council (MEPTEC) will host a technical symposium titled "Innovations in Equipment and Materials for Microelectronics Packaging: Complexity Drives Collaboration" on November 11, 2004 at the Hyatt San Jose in San Jose, California.
The workshop will be held in a two-session format, giving each supplier time for a short, concise presentation. Each session will be followed by an open question-and-answer session and interactive audience discussion moderated by a leading industry expert.
The focus will be on IC packaging needs from the front-end to back-end, particularly in the following areas:
Low-k device packaging Laser cutting/drilling Substrates Die attach Wire bonding Plating Dispensing Encapsulation Test Interconnect structuresTo register for or to learn more about the symposium, visit MEPTEC at www.meptec.org. The last day to register is November 5, 2004.