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Speedline Receives Patents for Enhanced System of Post-Print 2-D Inspection of Circuit Boards
September 21, 2004 |Estimated reading time: 1 minute
Franklin, Mass. — Speedline Technologies Inc. has been awarded U.S. patent #6,738,505 for its invention of the texture-based method of analyzing potential bridge defects on circuit boards during the post-print inspection process.
Introduced by Speedline in its MPM BridgeVision system, the patent-winning technique assesses the quality of paste deposits using texture-based image acquisition algorithms and a digital camera system. The system is integrated with the contrast-based 2-D paste inspection option for the post-print review of printed deposits inside the printer.
The new technology reportedly reduces scrap and rework costs by identifying defective and borderline products and preventing them from continuing through the assembly process. The BridgeVision system is available as an option on new — and as an upgrade to installed — Speedline MPM AP Excel and MPM AP HiE printers running Windows NT.
The patent was awarded for the method of using texture in the detection of paste in the region of interest between the printed deposits.
Additional features of the BridgeVision system include:
- Advanced texture-based image acquisition technology that is said to eliminate false positive detections associated with contrast-based bridge detection systems;
- Error alarms driven by both spike penetration and percentage gap covered measurements;
- Automatic initiation of stencil cleaning based on inspection measurements;
- Digital camera that supports highly accurate defect assessment.
- GUI settings to allow for user-defined limits for SPC control.
Speedline Technologies is the global leader for single-source process knowledge, solutions and service to the PCB assembly and semiconductor packaging industries. For more information, visit www.speedlinetech.com.