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IPC, FED Sponsor Embedded Passives Conference in Munich, Germany
September 15, 2004 |Estimated reading time: Less than a minute
Northbrook, Ill. — To address the growing interest in embedded passive component technology, IPC has teamed with the Fachverband Elecktronik Design e.V. (FED) to create a conference on the subject.
The conference will take place November 8 through 9, 2004, at the Munich Marriott Hotel. Featured subjects include embedded passive modeling, avionic applications, design software, probe and trim guidelines, and more specifics on the market. Some companies that will present include FUBA Printed Circuits GMBH; Sanmina - SCI; and Aspocomp Group. Tabletop exhibits will provide additional sources of solutions. The conference will conclude with a roundtable discussion by industry experts to assure that attendee questions are addressed.
For more information, visit www.ipc.org/EPGermany.