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Vianco Joins S-Bond Technologies Advisory Board
September 15, 2004 |Estimated reading time: 1 minute
Lansdale, Pa. — Paul Vianco, Ph.D., an expert in the formulation, testing and uses of solder materials, has joined the Advisory Board of S-Bond Technologies LLC (SBT).
Vianco is a principal member of the technical staff at Sandia National Laboratories in Albuquerque, N.M. He is currently the chairman of the American Welding Society (AWS) C3 Committee on Brazing and Soldering, as well as the national treasurer of the Surface Mount Technology Association (SMTA). The AWS is a technical organization dedicated to the advancement of material joining science and technology, while the SMTA is focused on the materials, processes and reliability aspects of surface mount printed wiring assemblies.
Vianco received his doctor of philosophy in materials science from the University of Rochester in 1986 and conducts research on both lead-free solder systems and novel soldering systems for sensors and optoelectronics.SBT is an early stage advanced materials company with proprietary technology for joining metals and ceramics, as well as diamond, glasses and carbon materials using active solder technology. These materials are lead-free, and create a bond in air and without the use of flux or corrosive chemicals. he company is focused on developing applications in electronic packaging and thermal management systems, sensor assemblies, and composite structures using high-performance materials.