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ERNI Publishes Roadmap for Compliance with RoHS
September 8, 2004 |Estimated reading time: 2 minutes
Adelberg, Germany — ERNI has prepared a roadmap to support customers in their planning for compliance with the EU's Restriction on Hazardous Substances (RoHS) Directive.
This document, which has also been made available for download at www.erni.com/leadfree, provides information about the strategy ERNI is using for development of new products and for current products to comply with the RoHS Directive, which takes effect on July 1, 2006.
All new connector developments from ERNI are already implemented in lead-free connecting technology (pure tin). This affects all types of connections, such as SMT, through-hole and press-fit technology. The material used for the insulating body for SMT and through-hole connectors is designed for use in the higher temperatures used in lead-free soldering processes, and contains none of the forbidden substances, such as mercury, cadmium, hexavalent chrome, polybromated biphenyl (PBB) or polybrominated diphenyl ether (PBDE). Consequently, the connectors comply with the RoHS Directive.
As a rule, the contact surfaces are gold-plated. For the terminal connections, a matte surface of pure tin is employed. ERNI generally employs a nickel barrier layer between the base material and the top coating. The terminal connection surface used features backwards compatibility, meaning that solders containing lead can be used as well as lead-free solders, such as SnCu, SnAg or SnCuAg. For press-fit technology, no limitations arise regarding function or processing.
All other standard connector series will also be available for delivery in lead-free versions. As far as the insulation body (LCP or PA, for example) is concerned, many ERNI connectors are already configured for the higher temperatures that can arise during reflow soldering (up to 260°C). Tests have shown that connectors with insulating bodies made of PBT can also be wave soldered without the use of lead. For lead-free reflow soldering, these connectors are available in through-hole variants with high-temperature material.
Since early 2004, all current products have been transitioning to lead-free connection technology. In this area, ERNI prefers a matte tin coating, which ensures better solderability and storability.
The part numbers (order numbers) will not be changed. The current inventory will be exchanged or used up in accordance with the FIFO principle. All lead-free products will be labeled as such. On ERNI's homepage, users can enter the part number to see if the changeover has already taken place for a given article.
ERNI develops and manufactures a wide variety of connectors for backplane and PCB applications. For more information, visit www.erni.com.