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Kester to Exhibit Wafer Bumping Paste at IMAPS
September 9, 2004 |Estimated reading time: Less than a minute
Des Plaines, Ill. — Kester will exhibit SE-CURE 7501 at Booth 235 during the upcoming IMAPS exhibition and conference, scheduled for November 14 through 18, 2004, at the Long Beach Convention Center in Long Beach, Calif.
SE-CURE 7501 is a wafer bumping solder paste formula designed for organic in-situ wafer bumping applications. The 7501 features a stable viscosity over a manufacturing shift down to bump pitches well below 125 µm for a consistent printing process module. Stable printing performance reportedly impacts the overall consistency of bump height across the wafer as well as from wafer to wafer.
Kester's SE-CURE 7501 bumping paste is engineered to facilitate a low-cost bumping method while enabling the highest quality end product. A part of statistical and methodical development effort requires a consistent void rate independent of pump pitch to remain below a 10 percent threshold. The voiding occurrence maximum of 10 percent is validated while varying wafer lots, solder paste lots, raw material lots, bump pitches, process conditions and other potentially influencing factors.
For more information on SE-CURE 7501 or Kester's full line of products and services, contact Kester by phone at (847) 297-1600 or 800-2-KESTER (53-7837); E-mail: mailto:customerservice@kester.com; or visit www.kester.com.