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SMTA International 2004 Products
December 31, 1969 |Estimated reading time: 8 minutes
Following is a variety of products offered from just a few of the exhibiting companies slated to be at SMTA International/ATExpo. Be sure to visit each exhibiting company for more complete product offerings.
Hot Melt Dispensing Valve
Micro Melt 1053 positive displacement and controlled flow precision dispensing valve reportedly is for applying hot melt and PUR adhesives and other single-component solid materials requiring heat for dispensing. The valve can be interfaced with the C-450 motion platform to create a turnkey operation. The valve uses proven rod displacement metering technology, providing extreme flow rate repeatability and accuracy from part to part. Depending on metering rod selection, the valve is capable of dispensing volumes from 0.002 to 3.6 ccs of material. Liquid Control Corp., North Canton, Ohio.
Clad Solder Preforms
Solder preforms that can be clad to various other metals are available. With these preforms, solder reportedly can be clad to various base materials to produce rigid links, jumper discs and other structural items. Solder also can be clad to one or both sides of the base material. These solder-clad materials can be produced in a range of shapes and solder alloys, and the base metal can be made from various alloys as well. Various packaging options, including bulk, trays, palettes, and tape-and-reel configurations, are available. Many of the preforms offer the option of flux coating. Applications for the solder-clad materials include use in jumper discs, gap filling and strength enhancing. Indium Corp., Utica, N.Y.
Placement System
SIPLACE HF/3 features three placement gantries and reportedly enables high-performance placement of passive, fine-pitch and odd-form components with linear motor positioning (X, Y and Z) for placement speeds of 40,000 cph and reliability. The system's 180 feeder inputs permit common feeder setups to shorten changeover times, and its flexible TwinHead reportedly is capable of placing 1" tall components and parts more than 7" long. An advanced component vision camera with four fully programmable lighting angles ensures alignment of connectors, BGAs and CCGAs. Siemens AG, Nuremberg, Germany.
Image Processing Software
GTI-5000 X-ray image processing software is said to include Auto-BGA, a feature that reportedly sets up BGA grids automatically and analyzes BGAs quickly. This feature also includes percent void, roundness, size and bridging. The software is designed for manufacturers using X-ray inspection to monitor the quality of assembled components in both laboratory and production environments. It also provides measurement and analysis tools for X-ray inspection of BGA components and PCBs. GTI-5000 performs the inspection routines required for numerous packaging technologies, as well as determines factors such as percent void, drill offset, wire sweep, linear distance and ball diameter. Glenbrook Technologies Inc., Randolph, N.J.
Ultrasonic Cleaning System
SonicOne is said to be a fully automatic, ultrasonic, non-hazardous, environmentally safe advanced stencil cleaning/misprint system. The user inserts the stencil into the transport shuttle and the system automatically provides wash, rinse and dry functions. The system removes all paste types including rosin, water-soluble and no-clean, as well as all SMT adhesives. It also reportedly is compatible with numerous environmentally friendly-approved chemistries. Aqueous Technologies Inc., Rancho Cucamonga, Calif.
Platform-based Placement Machine
Genesis Lightning platform-based placement machine is said to combine the throughput of the company's rotary Lightning head with the flexibility and component handling range of the Genesis platform. Each Lightning head features a radial array of 30 modular, individually controlled spindles. With two heads on the Genesis platform, the configuration delivers productivity-enhancing features that drive placement ranges to 54,000 cph. Dual on-the-head optics reportedly allow Lightning to address components ranging from 01005 to 30 × 30 mm. Universal Instruments Corp., Binghamton, N.Y.
X-ray Inspection System
XiDAT XD7600 X-ray inspection system for PCB assembly reportedly provides for oblique angle views of up to 70° for any position 360° around any point of the 18 × 16" inspection area. This manipulation allows the system to inspect all interconnections on PCBAs, including on BGA and CSP devices. The inspector features NT250, a proprietary filament-free X-ray tube that provides features recognition to 0.25 µm in a maintenance-free package. The tube, coupled with standard active anti-vibration control, is said to provide high-resolution image quality. Dage Precision Industries Inc., Fremont, Calif.
Lead-free Solder Paste
Multicore LF320 lead-free solder paste reportedly requires a minimum peak reflow temperature of 229°C vs. the commonly required minimum of 240°C. The 10°C advantage provides a safety margin when reflowing temperature-sensitive components. With a print speed range of 25 to 100 mms-1 and an abandon time of up to two hours, the paste is said to offer good wetting on various surface finishes. Multicore LF320 has been designed to provide high resistance to slump and solder balling. Henkel Technologies, Industry, Calif.
Stencil Technology
Additive stencil technology is said to allow users to create deposits of several heights in a single pass, increase throughput, reduce the number of process steps and increase equipment utilization. The technology reportedly extends the life of squeegee blades, the wipers of an enclosed printing head and the stencil itself. The technology can be applied to either side of the stencil. Building up selected areas on the stencil surface reportedly allows the height of selected deposits to increase by between 10 to 100 µm, compared to the nominal height determined by the main stencil thickness. The stencil can be built up in any area, up to 40 × 40 mm. The stencil technology is enabled by precision techniques that increase stencil thickness in controlled increments in specific areas of the stencil. DEK International GmbH, Flemington, N.J.
Automatic Insertion System
P350 X-Y insertion machine automatically inserts PCBs using its three product-specific insertion heads — each with a rotary insertion finger that applies products at different angles without rotating the PCB. Conversion kits for different insertion tools allow existing machines to be updated to apply different products as production requirements change. A multi-tasking controller is said to control the entire system by driving the motors and monitoring the insertion process. The system also is capable of inserting up to 350 pins per minute based on product location, offers a maximum insertion area of 600 × 400 mm and features 0.02 mm repeatability. Tyco Electronics, Business Segment of Tyco International Ltd., Willow Grove, Pa.
Concentrated Cleaning Solvent
AQUANOX A4520 concentrated cleaning solvent is for cleaning reflowed no-clean flux residues. The cleaner reportedly is effective on both reflowed solder paste as well as uncured SMD adhesives. It is environmentally safe, exceeds current SCAQMD requirements, is effective on solder joints and shows no negative effect after multiple passes through the cleaning process. The solvent features inhibition technology that is said to protect solder joints and bumps from oxidation and provide a brilliant finish after cleaning. The concentrated cleaner is for use on aqueous batch or in-line spray machines. Kyzen Corp., Nashville, Tenn.
Color Evaluation Feature
This company is equipping its inspection systems with an optional color evaluation feature. With an additional camera, color information can be integrated selectively into the inspection process where required. The feature is available for the company's standard AOI systems for inspecting solder joints and components. Color evaluation reportedly is the result of an additional sensor module that contains a color camera with special illumination. Viscom AG, Hanover, Germany.
Laser Soldering Work Cell
PRO-8b selective soldering work cell is for through-hole soldering and is targeted for use in bottom-side selective soldering. This latest version of the system features six selectable spot sizes as standard that range from 0.7 to 5.0 mm with pin-to-pin selectability through the software interface. The solder feed tube is said to dynamically adjust to ensure correct positioning to the joint. Additional features include a patented "Geyan" solder feed mechanism that perforates the wire as it is being fed and real-time viewing with quick editing of soldering parameters. Pro-Mation Inc., Kenosha, Wis.
Pick-and-Place System
Based on a software and hardware platform, CLM9000plus includes a new drive system, which is said to result in a 20 percent placement speed increase, as well as improved accuracy and repeatability. A new calibration set includes glass plates and components that allow customers to verify system accuracy onsite, or to meet ISO-9000 protocols. The software is based on the proprietary Easyplacer platform and reportedly can run complete sets of boards or place single boards in multiple boards in any angle in the machine. Automatic height detection of the feeders is integrated, and the software includes an improved link to the CLM-MIS management information system. ESSEMTEC USA LLC, Glassboro, N.J.
Benchtop Dispensing System
DispenseMate D-550 compact benchtop dispensing unit is said to offer advanced capability within a small footprint. Designed for various batch processes, including potting, form-in-place gasketing, solder paste and adhesive dispensing as well as rework operations, the dispenser reportedly offers a precision motion system with closed-loop brushless DC motors. Additional features include an integrated height sensor, digital gauges and an optional vision system. The 555 has a dispense area of 525 × 525 mm, and the 553 has a dispense area of 325 × 325 mm. Asymtek, Carlsbad, Calif.
SMT Support Tooling
Grid-Lok line of fully automatic SMT support tooling is designed for support of single- and double-sided circuit boards during the stencil printing and component placement processes. The system eliminates conventional pin arrangements and dedicated fixture plates that hold boards in place. The tooling system reportedly can be integrated with a host printer, pick-and-place system, and dispenser from any manufacturer, and features a locking system that guarantees component protection and eliminates board defects. Ovation, Division of Airline Hydraulics Corp., Bethlehem, Pa.
Flux Cores
ALPHA Cored Wire series creates consistent flux cores and ensures repeatability with a Cpk rating of 1.826. Available in 10 tin-lead and lead-free alloys, the wire complies with electronics assembly industry classifications, including J-STD-004, IPC-SF 818 and ISO 12224. The cored wire is created from a layer winding process that reportedly ensures consistent and smooth payout for manual and automatic solder rework.The wire is packaged in color-coded spools for identification of the flux chemistry. Cookson Electronics Assembly Materials, Jersey City, N.J.