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Indium Holds Annual Tech Summit
August 26, 2004 |Estimated reading time: Less than a minute
Clinton, N.Y. — Indium Corp. of America held their Annual Global Technical Summit recently here.
Industry experts provided education and expertise to the company's worldwide technical support team.
The summit provided an opportunity to discuss future electronic assembly process and material technologies, and allowed for the sharing of new ideas and expertise. Presentations included recent developments in equipment, processes, materials science, SnPb technology, Pb-free and electronic packaging technology, and new products, as well as an R&D roadmap.
Indium Corp. is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-free solder alloys, underfill materials, die-attach materials, and more. For more information, visit www.indium.com.