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Tyco Electronics Premiers New Products at ATExpo
August 24, 2004 |Estimated reading time: 1 minute
Willow Grove, Pa. — Tyco Electronics, a business segment of Tyco International Ltd., will be premiering Mirae's MX-Series assembly platform solution at Assembly Technology Expo (ATExpo), held September 26 through 30, 2004, in Rosemont, Ill.
MX-Series Assemblers are third-generation SMT assembly systems that reportedly enable entry into medium- to high-volume SMT OEM/contract PCB assembly factories. The design considerations for this feature-rich platform include100 DPMO (or less) placement performance from 0201s, placed 0.004" to 0.010" spacing at production speeds; fast changeover for high-mix, high-speed production environments; system reliability; and uptime.The MX-Series consists of two systems — the MX-310 and the MX-240 — and a range of features. For the MX-310, main features consist of a 0.09 optimal tact time (40,000 cph), a minimum of 32,000 IPC-9850 standard cph and a 0201 to 12 mm sq. component range, four stage conveyors (two buffers and two workers) and a chip height measurement device (CHMD). As additional benefits, this system offers users a wider 530 x 460 mm PCB support.
The MX-240 offers processing ability for a broad range of components, including 0201, QFP, BGA, CSP, flip chip, SMT connectors and odd-form. It also features high-speed and precise placement, with four heads working together for simultaneous recognition up to 18 mm components and closed-loop force control for each placement head. The MX-240 reportedly can inspect co planarity of precision leaded components and can place large connectors.
Tyco Electronics Automation Group (TEAG), a business unit of Tyco Electronics, is a leading supplier of automated equipment that is used in the manufacturing of printed circuit board assemblies and systems. For more information, visit automation.tycoelectronics.com.