-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTA Ohio Valley Chapter to Focus on Lead-free Solutions
August 24, 2004 |Estimated reading time: 1 minute
Minneapolis — "Materials, Processing, and Reliability of Lead-free Solder Solutions" will be presented by Dan Baldwin, Ph.D. of Engent Inc./Georgia Institute of Technology on October 26.
This program, sponsored by the SMTA Ohio Valley Chapter, will be held at the Radisson Hotel Columbus in Worthington, Ohio, in conjunction with the chapter's annual vendor day.
This course will present a review of the materials, processes and reliability of lead-free solder solutions. It will focus on materials selection based on environmental impact, legislation and market trends. It also will highlight lead-free solutions for component lead terminations, connectors and PCB surface finishes.
Process implementation strategies and issues from printing wave soldering and rework will be presented, a discussion on backwards compatibility of lead-free solder will be included, and reliability and qualification of lead-free solder solutions across multiple industrial efforts will be reviewed.
For more information on this event, visit www.smta.org/education/chapter_tutorials/chapter_tutorials.cfm.
Baldwin holds a Ph.D. in mechanical engineering from MIT and is a founder of Engent Inc., providing enabling process technologies and manufacturing services in electronics, optoelectronics and MEMS. He is also an associate professor of mechanical engineering at the Georgia Institute of Technology, heading up the Low Cost Flip Chip Processing Program for the Packaging Research Center, the Advanced Interconnect Technologies Research Program for the Manufacturing Research Center, and the Low Cost Assembly Processing Program for the CBAR. Baldwin currently serves on the SMTA Board of Directors.
The SMTA membership is a network of professionals who build skills, share practical experience, and develop solutions in electronic assembly technologies and related business operations. For more information, visit www.smta.org.