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AIM Forms Semiconductor Packaging Materials Division
August 18, 2004 |Estimated reading time: Less than a minute
Cranston, R.I. — AIM has formed AIM Semiconductor Packaging Materials.AIM Semiconductor Packaging Materials is a direct subsidiary of AIM Specialty Materials, which specializes in indium and gold alloys for a variety of joining applications. AIM Semiconductor Packaging Materials supplies products such as BGA solder spheres, preforms, epoxies, BGA/CSP fluxes, solder pastes and touch-up materials to the semiconductor packaging industry. AIM Semiconductor Packaging Materials also supplies a wide range of advanced thermal interface materials (TIM). These metal-based TIMs provide thermal transfer in applications where performance of thermal grease is insufficient.AIM is a leading global manufacturer of assembly materials for the electronics industry. For more information, visit www.aimsolder.com.