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SMTA Announces Academy and Certification Programs During NEPCON Texas
August 9, 2004 |Estimated reading time: 1 minute
Minneapolis — The SMTA Academy Program and SMT Process Certification will be held in Arlington, Texas, October 20 through 21 at the Arlington Convention Center in conjunction with NEPCON Texas.
The Academy Program targets audiences with offerings tailored to the interests of local professionals. Courses for this event include the following:
- Surface Mount Technology Fundamentals
- Lead-free Rework: Just Turn Up the Temperature?
- Best Practices in Implementing Lead-free Assembly
- Flip Chip Processing and Technology Using No Flow Underfills
- Embed Resistors and Capacitors in Circuit Boards Now
The SMTA Certification Program for SMT Processes is intended for engineers with at least one year of SMT experience and competence in engineering math. he SMT Processes curriculum (October 19 through 21) covers SMT materials and components, stencil printing, dispensing, component placement, reflow and wave soldering, test and inspection, and line balancing. The program is a three-day workshop consisting of refresher topics and course materials on the first day and a half, and examinations on the following day and a half.
Two special free events during this event include a panel discussion on lead-free and an SMTA general meeting featuring Daniel Baldwin, Ph.D., from Engent Inc., who will speak on New and Emerging Technologies.
For more information on these programs, visit www.smta.org/education/academy/academy.cfm or www.smta.org/certification/certification.cfm.
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations. For more information, visit www.smta.org.