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New Products
December 31, 1969 |Estimated reading time: 9 minutes
Reworkable Underfill Encapsulant
CN-1453 reworkable BGA underfill encapsulant is a silica-filled version of the company's earlier CN-1432, and offers a lower coefficient of thermal expansion. The material features a viscosity of 7,500 cps at room temperature. Additionally, the encapsulant is said to be capable of flowing a distance of 18 mm, with a single-side dispense in a minimum of 20 seconds. Reportedly exhibiting good wetting, the material self-fillets, eliminating the need for seal passes to create complete and symmetrical fillets. Post-reflow, the encapsulant can be cured in five minutes in an in-line oven at 165°C. Zymet Inc., East Hanover, N.J.
Surface Mount Fuse
USF 0603 surface mount fuse reportedly features a high interrupt rating, as well as a 50 A breaking capacity at 32 V AC/DC across the range. Additionally, the thin-film chip fuse offers a low voltage drop and power dissipation rating, providing good performance in dense circuits. Its quick-acting characteristic is said to be suited for sensitive electronics devices that require reliable overcurrent protection. The fuse measures 1.6 × 0.8 mm, and is packaged in 5,000- or 15,000-piece reels. Built according to UL 248-1 and cURus approved, the fuse is lead-free, including the fusing element. Schurter Inc., Santa Rosa, Calif.
Cleaning Wipes
Isopropyl alcohol (IPA) and de-ionized (DI) water industrial strength cleaning wipes are said to combine traditionally effective IPA with modern non-woven disposable wipe technology. The disposable wipes are saturated and packaged in reclosable dispensers. Known as a universal cleaner and disinfectant, the combination of IPA and DI water forms an azeotrope with water, which evaporates faster than water alone for removal of soils and moisture while not leaving residue. IPA/DI water is CFC- and HCFC-free, non-aggressive and an evaporator with a mild odor. The lint-free wipes are said to remove most inks, pastes, light oils and contaminants associated with most industrial cleaning applications. The wipes do not scratch soft surfaces; however, they feature an active texture to remove soils from surfaces and absorb liquids. JNJ Industries Inc., Franklin, Mass.
Dispensing Workstation
Ultra 2400 dispensing workstation system is said to apply accurate, consistent amounts of solder paste, flux, adhesives, epoxies and other fluids used in electronics assembly pro-cesses, from uniform dots as small as 0.004" to controlled beads. The system features a vertical design to conserve benchtop space as well as a small footprint. Standard features in-clude simultaneous digital display of dispense time, air pressure, vacuum, shot count and dispense mode; dispense time adjustable in 0.0001-second increments for control of deposit size; and an internal pressure reservoir that reduces cycle time and improves deposit control. EFD Inc., East Providence, R.I.
Assembly Tools & Equipment
Wavesolder Conveyor
Hump-Back conveyor is designed to handle hot circuit boards exiting wavesolder machines. The belt is static dissipative and available with full surface ribs for increased convection cooling. Custom angles and elevations for drop-in replacement of existing systems are said to be available. The conveyors are designed for maintenance-free performance, and come standard with 115 V DC brushless motors with variable speed drive to match exit speed. The custom-molded belting offers snap-together features and proprietary self-lubrication additives that reportedly eliminate most belt wear. SmartMove Conveyors, Fall River, Mass.
COMPONENTS
Silicon-based RF Capacitor
HPC0201 A silicon-based RF capacitors in an 0201 footprint are designed to reduce the size and improve the performance of wireless communications products. Based on a proprietary semiconductor process, the capacitors reportedly allow higher-performance, higher-precision operation at high frequencies, and allows for low parasitic inductance and tight tolerances. Device dimensions are 0.024 × 0.012" (0.61 × 0.30 mm) with a height profile of 0.009" (0.23 mm). The capacitor's single-side contact configuration is said to eliminate tombstoning, and the smooth, flat surface simplifies the pick-up step in pick-and-place operations. Vishay Intertechnology Inc., Malvern, Pa.
Pin-and-Socket Interconnect System
A non-intrusive pin-and-socket interconnect system reportedly eliminates the need for specialized handling or equipment. Both the pin and socket components are packaged in standard EIA tape-and-reel formats for direct pickup and placement by industry-standard automated equipment. Additionally, the system is said to allow for maximum overall production efficiency by adapting to existing single-side SMT reflow processing techniques. The system features flat-headed pins that do not require specialized placement equipment or packaging, and are for use with thin PCBs. The socket components are designed for self-alignment, and typically are placed on the motherboard of a stacking assembly. Autosplice, San Diego, Calif.
Surface Mount Optocoupler
FODB100 single-channel optocoupler is said to feature a transistor output housed in a BGA package, and is for use in both consumer electronics and industrial applications. The component measures 3.5 × 3.5 mm with a profile of 1.2 mm maximum mounted height, and features an operating temperature range of -40° to 125°C. The optocoupler consists of an aluminum gallium arsenide infrared light-emitting diode (LED) driving a silicon phototransistor. Reportedly featuring isolation of 2,500 Vrms for 1 second and high current transfer ratio at low input current levels, the lead-free component is designed for conventional voltage isolation in power system feedback circuits, and for isolating signals in high-voltage, electrically noisy environments. Fairchild Semiconductor, San Jose, Calif.
DISPENSING EQUIPMENT
Digital Dispenser
JGD-200S digital dispenser reportedly offers syringe dispensing with digital timer control and readout. The system offers a digital timer with a range of 0.01 to 99.99 seconds, air pressure control and vacuum pullback capability. Additionally, the dispenser features an interval setting that allows for continual dispensing with the foot pedal depressed, in timed mode, with an interval break from less than a second up to 7 seconds. Standard accessories reportedly include a syringe stand, foot pedal, power cord, fittings for various syringe adapters and needle samples. An optional vacuum pick-up version (JGD-200SV) is said to include a venturi hand wand with push-button control that activates the vacuum wand only when needed. Jensen Global Inc., Santa Barbara, Calif.
Flux Application System
JefFlux precision flux application system is said to demonstrate good hole penetration and fill, uniform coverage, and minimal bridging. The system applies numerous fluxes at programmed flux volumes. A servomotor actuator provides reliable and precise flux volume, and there is said to be limited overspray and minimal maintenance. The system is programmed with an advanced graphic user interface that can be integrated with the wavesolder system interface. Flux can be applied for full coverage or for selected locations. Precision Dispensing Equipment Inc., Bay Village, Ohio.
INSPECTION EQUIPMENT
Camera Verifier
Smart camera Data Matrix reader is said to feature a built-in verifier that implements the company's direct part mark verification capabilities. The camera is an addition to the HawkEye smart camera line. Data matrix 2-D codes marked directly on parts using methods such as laser marking, ink jet printing or dot peening allow identification of individual parts and implementation of unit-level traceability. To ensure readability of direct part marks, mark quality must be verified post-marking. Verifying a mark differs from reading because it both confirms the readability of the mark as well as indicates how close to the edge of readability a mark is. This allows users to monitor their marking processes continuously and to make changes before the marking system produces unreadable marks. Robotic Vision Systems Inc. (RVSI), Nashua, N.H.
3-D Paste Inspection Option
The S3054QS QuickScan inspection system is said to feature 3-D paste inspection as an auxiliary option. The option can be used on critical components such as BGAs and flip chips, as well as for checking paste printing. A light section method has been implemented using a dual-line laser illumination for good image recording. Using the modular 3-D height sensor concept, a height resolution of 10 µm is said to be possible. In addition to the error characteristics of missing paste, smearing and short circuits, this allows the height of the paste print, the volume and the topography to be measured and evaluated. Viscom AG, Hannover, Germany.
X-ray Platform
COUGAR-VXP (Versatile X-ray Platform) is said to address a range of inspection requirements throughout the industry, from basic failure analysis to high-end inspection for SMT production. The system provides a basic platform for further equipment and accessory implementation, depending on specific needs. The initial configuration includes a standard microfocus X-ray tube up to 160 kV, TXI control, standard 4-axes manipulator, advanced real-time image processing system, and a standard real-time image chain with a high-resolution 4" image intensifier and flat-screen monitor. The system is targeted for use in any failure analysis and assembly environment because it features a 1 × 1 m footprint, a weight of 1,450 kg, and both front and side door service access. FEINFOCUS, Stamford, Conn.
SOFTWARE
Rework Control Software
ThermoActive software version 3.21 is said to reduce rework setup and changeover times to minutes, as well as remove the human element from the process to simplify high-end repairs. The software can handle changes in both board and device type automatically, without teaching modes or operator training. The software allows BGAs and other such devices to be removed and reworked with the user simplicity of hand tools, but the process control and capability of rework stations. A significant feature of the latest release is the time and temperature modes for configuring soldering profiles. Combined with real-time feedback of board and device temperatures from the rework station, the modes reportedly allow the process to run automatically without a technician. The software package is for use on the company's X410 BGA and SMT rework station. PDR America, Sacramento, Calif.
Line Management Software
Flexa SMT line management software is said to provide a flexible solution that integrates into production environments, while increasing productivity with wizard- and macro-based automation. Software functionality includes integration with other host systems, customizable XML report formats, flexible board layout support, automated data creation, security features, off-line production verification, flexible database sharing, real-time factory monitoring and Internet/intranet production reports. Fuji America Corp., Vernon Hills, Ill.
SOLDER MATERIALS
Solder Preforms
Line of solder preforms includes a range of solder alloys, as well as the capability to produce numerous sizes and shapes. Various shapes are available, including washers, discs, rectangles and squares, "picture frames," shot, spheres, ganged arrays, and specialty shapes. Additionally, the preforms are said to be available in a range of sizes: discs are made with diameters as small as 0.004", and washers are made with inner diameters as small as 0.015" and outer diameters to 0.025". The preforms can be specified in most of the company's close to 300 alloys, including lead-free. Many also are available with the option of flux coating, which reportedly can improve quality, efficiencies and production cost. Packaging options include jar, tray, palette, and tape-and-reel. Indium Corp., Utica, N.Y.
Laminate and Prepeg Material
Polyclad 370HR CAF-resistant, lead-free, assembly-compatible laminate and prepeg system is said to be for use in high-density designs requiring multiple soldering steps. Additionally, the material contains a resin technology that has been production-proven to offer a high number of cycles to failure. UL listed as PCL-FR-370HR laminate and PCL-FRP-370HR prepeg, the materials reportedly are compatible with all commonly used FR-4 fabrication process techniques. The system also features mechanical, chemical and moisture resistance and is laser fluorescing and UV-blocking for compatibility with AOI, optical positioning systems and photoimageable soldermask imaging. Polyclad Laminates Inc., a Cookson Electronics Business, Londonderry, N.H.