-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
NEMI Makes Recommendations for Lead-free Part Identification
June 14, 2004 |Estimated reading time: 1 minute
Herndon, Va. — The National Electronics Manufacturing Initiative's (NEMI's) Component and Board Marking Project has made recommendations for the identification of electronic components and board assemblies that have been modified for use in lead-free assembly processes.
The team also has identified standard vocabulary terms to create a common terminology related to lead-free processing.
The NEMI team provided input to and supported the development of JEDEC standard JESD97: Marking, Symbols, and Labels for Identification of Lead (Pb) Free Assemblies, Components, and Devices, which was released in May of this year. NEMI considers the identification model in this standard comprehensive enough to meet the needs of manufacturing.
In addition to the guidelines outlined in the JEDEC standard, NEMI is recommending the use of unique part numbers for lead-free materials, components and boards to distinguish them from tin-lead (SnPb) versions. NEMI also has developed three standard vocabulary terms in an effort to establish a common language for communication of lead-free transition status. The terms defined by NEMI are Pb-free Second Level Interconnect, Pb-free and RoHS-compliant. However, the project team decided not to develop a guideline for identification of RoHS compliance or the various phases of lead-free implementation, as there are several uncertainties in developing a good definition of these terms.
The NEMI-developed definitions have already been included in the RosettaNet dictionary of terms RNTD version 4.0, and have been proposed to IPC and JEDEC for inclusion in their dictionary of terms. The Component and Board Marking Project's recommendations are available on the NEMI web site at www.nemi.org/projects/ese/Component_BoardMarking.html.
The National Electronics Manufacturing Initiative's mission is to assure leadership of the global electronics manufacturing supply chain. For more information, visit www.nemi.org.