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Convergence of Technologies Boosts Sales of Electronic Components, Says Frost & Sullivan
April 26, 2004 |Estimated reading time: 1 minute
Palo Alto, Calif. — New analysis from Frost & Sullivan, World Electronic Components and Packaging Market, reveals that revenue in this market totaled $8.25 billion in 2003 and is projected to reach $17.10 billion by 2010.
Manufacturers of electronic components and software vendors are benefiting from the healthy growth of computer peripherals and office equipment markets. Periodic upgrades of the equipment also drive the market. Further impetus is provided by the emerging demand in Asian countries, where there is a proliferation of computer networking and related applications for home, industry, and education.
Component manufacturers are facing end-user demand for smaller, faster, portable and economical devices. As electronic assemblers place electronic components onto printed circuit boards (PCBs), miniaturized components are crucial for smaller applications. Participants that can optimally integrate their components into small suites without compromising on performance are likely to gain a foothold in this market. Additionally, R&D also is focusing on improving existing packages, such as ball grid arrays (BGA), chip scale packages (CSP) and multi-chip modules (MCM).The demand for infrastructure development for information transfer in Asian countries, such as China and India, where North American businesses are outsourced and contributes significantly to the electronic component and packaging market. So does the growing demand for high-end applications, such as Web-enabled network video cameras, medical applications, such as glaucoma monitors and imaging equipment and consumer devices that demand higher automation.
Frost & Sullivan, an international growth consultancy, has been supporting clients' expansion for more than four decades. For more information, www.electronics.frost.com.