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UK — Tin Technology will be exhibiting at NEPCON 2004 at booth U404, offering the electronics industry hourly, half-day and full-day pre-booked inspection time on its new XiDAT 6600 X-ray imaging system.
The new X-ray equipment will add to the capabilities of Tin Technology's Soldertec group, which already provides a range of technical, marketing and information services to the global electronics sector.Tin Technology recently has completed the installation of XiDAT 6600 X-ray imaging equipment supplied by Dage Precision Industries, who are exhibiting at booth H334.The laboratories of Soldertec are conveniently located at Curo Park, near St. Albans and will offer customers an opportunity to use the XiDAT X-ray system at competitive rates. The Curo Park site will also act as a Dage XiDAT machine demonstration center and site for future joint seminars. Feedback from Tin Technology will be used as part of the Dage product development program.
Soldertec Global is a membership-based organization focusing on research into soldering technology, including lead-free issues. For more information, visit www.lead-free.org.