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Vectron's Vilella Named Co-chair of IPC AOI Committee
February 24, 2004 |Estimated reading time: 1 minute
San Diego — Vectron Inc. announces the appointment of Joe Vilella, president and CEO, as co-chairman of the IPC 7-32 Automated Inspection Technologies committee.
This significant industry subcommittee was formed with the goal of helping surface mount technology manufacturers deal with the present and future challenges posed by the continued trend of miniaturization in this industry through proper application of state-of-the-art inspection technologies.
Vilella is responsible for the efforts to create up-to-date industry standards for the proper evaluation and implementation of automated optical inspection (AOI), automated X-ray inspection (AXI) and automated paste inspection (API) technologies to the SMT process. Amit Verma, who co-chairs the 7-32 subcommittee with Vilella, is responsible for the efforts to translate IPC-A-610 solder joint acceptance criteria into a language directly measurable by automated inspection machines through the correlation of data from AOI/AXI inspection methods to the reliability of lead-free solder joints via thermo-cycling. Both Vilella and Verma report to John Perry, IPC staff liaison, who is responsible for the oversight of this as well as several other critical committees related to the improvement of SMT methodologies and processes.
Vectron Inc. is the developer of the 2003 award-winning digital color AOI technology fully based on parametric analysis. For more information, visit www.vectroninc.com.