New, Reliable QC Routine for Solder Pastes Subject of Presentation at APEX 2004


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Breda, Holland — Ineke van Tiggelen-Aarden, technical director for Cobar Europe BV Holland, will present "A Fast, Precise and Reproducible QC-Rheometry Routine for Solder Paste" at APEX 2004, in the Solder Paste Printing Technical Session, Tuesday, February 24, from 1:30 to 4 p.m.The paper outlines a new rheometric QC-routine for solder paste that takes approximately 16 minutes, and is based on the combination and automation of two different methods. The new QC-routine yields precise, reproducible results usable in an SPC program. Moreover, it provides a complete overall picture of the printing properties of solder paste, including its numeric classification regarding slumping, tackiness, its performance at different speeds and its sensitivity to temperature variation.SPC data has shown that the solder paste printing process is the primary source of soldering defects in SMT assembly. Verification of the specified printing properties of solder paste is of paramount importance in the pursuit of higher quality goals, and higher overall yields. For more information about Cobar, visit www.cobar.com. For more information on APEX, visit www.goapex.org.

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