Indium, Speedline, KIC to Present One-Day Lead-free Implementation Workshop


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Foxboro, Mass. — Indium Corp. of America, Speedline and KIC have partnered to deliver a one-day Pb-free Implementation workshop.

Titled "How to Implement Pb-free at Your Factory," the one-day seminar focuses on the how-to of implementing a Pb-free electronics assembly process. The seminar will be held on Tuesday, March 16, at the Speedline Technologies facility in Foxboro, Mass., at a cost of $295 per person.

Topics to be covered include:

  • A review of current legislation and practices in lead-free electronics assembly
  • Current alloys in use and why and how they were selected
  • PWB finishes for lead-free assembly
  • Component concerns in lead-free assembly
  • Best practices in SMT processes for lead-free assembly: printing, placement, reflow, wave
  • Implementing the lead-free reflow process
  • Special considerations for large boards
  • Establishing a lead-free implementation plan.

The seminar also will include a special case study, entitled "Implementing Lead-free to Assemble 5 Million Cell Phones: The Motorola Experience," which will include:

  • Solder paste evaluation
  • Statistical analysis of process data
  • Process optimization
  • Analysis and corrective actions for failure modes such as tombstoning
  • Reliability analysis

Detailed information will be presented on:

  • The state of lead-free legislation, marketing and implementation worldwide
  • The current alloy systems in use and why and how they were chosen
  • Which PWB finishes are preferred in lead-free assembly
  • Concerns with components and the status of lead-free components in the industry
  • Best practices for setting up stencil printing, placement, inspection, reflow and wave
  • The effect of LF manufacturing on the reflow process, achieving and maintaining the tight process window
  • How to perform designed experiments (DOE) to optimize a lead-free process
  • How to establish a statistical process control program

Speaking at this seminar are:

Ronald C. Lasky, Ph.D. Lasky is a senior technologist at Indium Corp., a visiting professor at Dartmouth College, and an SMT Editorial Advisory Board Member. He has more than 20 years experience in electronic and optoelectronic packaging at IBM, Universal Instruments, Cookson Electronics and Indium Corp. He has authored or edited five books on science, electronics and optoelectronics, as well as numerous technical papers. He has also been an adjunct professor at several colleges and has taught more than 20 different courses on topics ranging from electronic packaging, materials science, physics, mechanical engineering, and science and religion. Lasky holds numerous patent disclosures and is the developer of the several new concepts in SMT processing software relating to cost estimating, line balancing and process optimization. He is the co-creator of engineering certification exams in electronic assembly. Lasky was awarded the Surface Mount Technology Association's Founder's Award in 2003.

Marc Apell. Apell is director of thermal & cleaning products for Cookson Electronics Equipment, Camdenton, Mo., where he is responsible for ACCEL cleaning systems, as well as ELECTROVERT cleaning, reflow and wave soldering systems. Apell has been with Cookson Electronics since 1995, and has held the positions of material planner, master scheduler, inside sales manager and reflow product manager, interfacing between sales and operations to meet customer and operational demands. Apell holds a B.S. in operations management from DeVry University, Kansas City.

Marybeth Allen. As national sales manager for KIC, Allen's expertise lies within the management of the thermal process. She has 20 years of experience in the electronics assembly industry covering surface mount, thick film and packaging. Traveling throughout North America, she has the opportunity to work with varied EMS companies, as well as OEMs with commercial, medical and military products. As Project Manager she works with manufacturers of equipment and materials for board and package assembly for thermal processes. Allen is in charge of KIC¹s partner program. She is a past chapter president of SMTA and IMAPS and has authored various industry papers.

More information can be found at www.indium.com/QuickStart or by calling Leo Devine at (315) 381-7598.

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