NEMI Kicks Off 2004 Roadmap


Reading time ( words)

Herndon, Va. — The National Electronics Manufacturing Initiative (NEMI) will kick off its 2004 roadmap March 24 through 25.

NEMI member Sun Microsystems will host the meeting at their facility in Newark, Calif. (7777 Gateway Blvd.).

Every two years, NEMI maps the future manufacturing needs of the global electronics industry in order to identify the key technology and infrastructure developments required to assure leadership of the supply chain over the next decade. It helps companies anticipate shifts in product requirements and provides an early warning of changes in technology or infrastructure.

In 2004, NEMI marks the 10th anniversary of this highly successful initiative. The first roadmap was created in 1994 by the National Electronics Manufacturing Framework Committee, a group of 200 individuals from industry, government and academia, who came together to study the challenges facing the nation in electronics manufacturing, and to develop technology roadmaps and policy options with which to address these challenges.

Since that time, the roadmap has served as the foundation of all NEMI activities. NEMI uses the roadmap's forecasts to identify critical technology and infrastructure gaps, prioritize R&D needs to meet these gaps, and initiate activities to address industry needs. NEMI currently is recruiting industry experts to participate in the 2004 roadmap (NEMI membership is not required for participation).

Roadmap teams are organized into Product Emulator Groups (PEGs) and Technology Working Groups (TWGs).

The PEGs define the future manufacturing needs of "virtual products" from seven areas:

  • Portable/consumer,
  • Office/large business systems
  • Netcom (network/datacom/telecom)
  • Automotive
  • Aerospace/defense
  • Medical products, and
  • System-in-package (SIP).

The TWGs use the product requirements developed by the PEGs to forecast trends for 18 technology and infrastructure areas. Each TWG predicts the evolution of technology and/or business practices for its specific area; identifies gaps and "showstoppers" in the existing technology and/or infrastructure; and develops recommendations for their respective areas.

The PEGs and TWGs typically meet by teleconference, sometimes as often as once a week. Limited travel is required of the group chairs, and there are only two face-to-face meetings scheduled that include all PEG and TWG members (the kick-off meeting and a review meeting June 21 through 23).Changes in this year's roadmap cycle include increased involvement from participants around the globe to provide a more international focus. The 2004 roadmap will cover three new product emulators: netcom, SIP and medical products. In addition, there will be increased emphasis on identification and discussion of disruptive/breakthrough technologies and innovation.

The roadmap meeting starts at 1 p.m. on Wednesday, March 24, and will conclude no later than 5 p.m. on Thursday, March 25.

On Wednesday, each of the PEGs will discuss their emulator chapters, followed by breakout working sessions for the TWGs. Followup summary sessions are scheduled for Thursday. Agenda and logistics information will be posted as they become available on the NEMI Web site: www.nemi.org/roadmapping/status.html.

The National Electronics Manufacturing Initiative's mission is to assure leadership of the global electronics manufacturing supply chain. For more information, visit www.nemi.org.

Share

Print



Copyright © 2019 I-Connect007. All rights reserved.