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IPC Selects 17 Companies for their Revolutionary Technologies
January 30, 2004 |Estimated reading time: 2 minutes
Northbrook, Ill. — IPC — Association Connecting Electronics Industries announces the groundbreaking technologies chosen for this year's Innovative Technology Showcase (ITS), which will be held February 24 through 26, 2004, at the co-located IPC SMEMA Council's APEX, IPC Printed Circuits Expo and IPC Designers Council Summit exhibition and conference in Anaheim, Calif.
Previously exclusive to IPC Printed Circuits Expo, the 2004 ITS will now showcase new and emerging technologies from all segments of the electronics interconnection supply chain, including assembly, printed circuit board fabrication and design.
After a rigorous review, the ITS Review Board has selected these cutting-edge technologies for their value to the industry:
- Teradyne — New technology that protects low-voltage parts during ICT.
- FEINFOCUS — New approach of controlling the output level of X-ray intensity, which provides 100 percent consistent X-ray images of production anomalies.
- Lloyd Doyle — AOI tool for testing embedded passives.
- Zymet — Underfill encapsulant for CSP and BGA.
- DEK — Via filling process that delivers 100 percent fill with no voids.
- Seika Machinery — Handheld, portable stencil cleaners to be used on the printer without requiring stencil removal.
- Assembléon — Modular platform that can easily scale volume or component capability, as demand changes, without redesigning factory layout.
- Dynamic Details — New microvia plate-fill technology for easy stacking of microvias.
- FinePoint — Surface residue tester for critical circuits or components of today's sensitive designs.
- Mentor Graphics — Software logic that models and optimizes use of embedded resistors in design.
- APS/Novastar — Horizontal convection oven that enhances process quality and reduces maintenance, operating and energy costs
- Speedline Technologies — Breakthrough gel-based tooling system for support of boards during printing
- Universal Instruments — Placement head that employs variable reluctance linear motor technology in a direct-drive rotary design.
- W.L. Gore — Lightweight, metallized plastic material, thermoformed to match designs and provide unparalleled EMI shielding.
- Grace Electron USA — Halogen-free, lead-free, anti-CAF and high Tg performance copper clad laminates.
- Ohmega Technologies — Resistivity thin film with a low 3 percent material tolerance, giving finished embedded resister tolerances of 5 to 10 percent without additional trimming.
- Oak Mitsui — New material for buried capacitors — the thinnest available that also passes the 500 V Hi-Pot testing.
White papers, charts and graphics of the winning exhibitors' new products, displaying ways that attendees and exhibitors can improve company operations, will be prominently displayed in a special area of the Anaheim Convention Center.
For more information, visit shows.ipc.org.
IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,200 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit