Design Community to Converge on Anaheim

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Northbrook, Ill. — IPC — Association Connecting Electronics Industries and its Designers Council have announced the program for its second annual IPC Designers Council Summit.

The conference, which is IPC's foremost event specifically targeted for printed circuit board (PCB) designers at all levels, takes place February 22 through 26, 2004, in conjunction with the co-located IPC SMEMA Council's APEX and IPC Printed Circuits Expo conference and exhibition in Anaheim, Calif.

After a successful inaugural Summit in 2003, in which more than 220 PCB designers assembled in Long Beach, Calif., IPC plans to further strengthen the design and manufacturing links of the PCB supply chain through the abundant design-focused offerings of the 2004 conference.

Mentor Graphics, a major supplier to the computer aided design (CAD) industry, will sponsor two interactive hands-on workshops, providing designers real world experience on high-technology software and teaching several ways to influence design elements, without sacrificing performance to reduce costs.

The first session, "Fundamentals of High-Speed Digital Design," on February 23 from 9 a.m. to noon, will be a non-mathematical introduction to signal integrity for high-speed digital design, as attendees will experiment with high-speed phenomena through hands-on labs.

"Embedded Component Design: A Hands-on Experience," will be the topic of the second session on February 23 from 2 to 5 p.m. Designers will participate in an embedded component design class, examine the benefits of embedded components and discover ways to implement various embedded technologies at the PCB level.

IPC will also offer Off-Site Applied Training on February 25 from noon to 5:30 p.m., at TTM Technologies. Attendees will be able to directly examine the processes, observe the chemistries and handle the end product through a series of lectures, group discussions and a facility tour. The Applied Training workshops will focus on Design for Manufacture, and cover the following:

  • Design Parameters — the use of coupons, general requirements for good design practices, documentation, dimension practices, panelization, fiducials, annular ring, testing conditions, fabrication issues and methodologies that impact the cost of multi-layer products.
  • Future Design Philosophies — the complexity of future design and package design levels, the Jisso concept, feature pitch use of multiple pitches, ball diameter to land description, grid systems and routing strategies and cost adders.

Designers who aspire to become Certified Interconnect Designers (CID) and Advanced Certified Interconnect Designers (CID+) will also be able to participate in the IPC Designer's Council Certification programs on February 27-29, as part of the 2004 IPC Designers Summit. Developed to assess one's knowledge of how to transform a schematic into a reliable rigid PCB design that can be easily manufactured, assembled and tested, these certification classes are based on several critical IPC documents that link design principles to the end product use of the printed wiring assembly.

In addition, attendees of the 2004 Designers Summit are encouraged to network with industry leaders and meet suppliers and manufacturers who influence design choices and capabilities at the show's three free keynote sessions, comprehensive show floor with more than 450 booths, show floor reception, free forums and Gala reception.

For more information about the 2004 IPC Designers Council Summit, visit

The IPC Designers Council is a professional society of designers forming an international network. Its mission is to promote printed board and printed board assembly design as a profession and to encourage, facilitate and promote the exchange of information and integration of new design concepts through communications, seminars, workshops and professional certification through a network of local chapters.

IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,200 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit



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