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FPGA Versus ASIC Design to Kick off IEC Executive Forum at DesignCon 2004
December 22, 2003 |Estimated reading time: 1 minute
Chicago — The International Engineering Consortium (IEC) announces that the IEC Executive Forum at DesignCon 2004 will begin on Wednesday, February 4, 2004 at 9 a.m. at the Santa Clara Convention Center in Santa Clara, Calif., with a panel discussion titled "FPGA vs. ASIC Design" sponsored by Mentor Graphics.
Industry leaders in both field-programmable gate arrays vs. application-specific integrated circuits will debate the pros and cons of FPGAs and ASICs as well as the viable emerging alternative — the structured ASIC solution — and will discuss how all three are shaping the future of electronic design automation.
Panelists include Steve Douglass, senior director of new product development for the Advanced Products Group at Xilinx; Bryan Lewis, director and chief analyst at Gartner Dataquest; Jim Smith, director of EDA vendor relations at Altera; Richard Tobias, vice president of the ASIC and Foundry Business Unit, Toshiba America Electronic Components; and Ronnie Vasishta, vice president of technology product marketing at LSI Logic.
The Executive Forum provides an educational opportunity for industry leaders, with a full day of executive programming and the chance to meet, network, and trade knowledge and expertise in an interactive educational atmosphere.
Following the opening panel, DesignCon Conference Chair Greg Spirakis of Intel moderates the plenary panel "The Roadmap to 65 Nanometers: Design Needs and Technical Challenges." Tsugio Makimoto, corporate advisor for semiconductor operations at Sony Corp., delivers the Wednesday keynote address preceding the opening of the technology exhibition at 12:30 p.m.
The Executive Forum concludes with two Monday afternoon panels, "EDA Licensing Models" at 2:30 p.m., chaired by Richard Tobias, and "Leadership in Times of Change" at 4:00 pm, chaired by Mark Pierpoint, vice president of marketing at Agilent Technologies.
As DesignCon continues to grow, the IEC Executive Forum at DesignCon increasingly becomes an important experience for senior-level managers and executives in the semiconductor and EDA industries.
The DesignCon conference program provides education and updates on the latest technology news and advances affecting design engineers working at the chip, board and system levels. DesignCon 2004 will feature specialized tutorials on nanotechnology and a new conference track devoted to wireless topics.
The International Engineering Consortium (IEC) is a nonprofit organization dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities.