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Entire Supply Chain Present at IPC's 2004 Technical Conference
December 15, 2003 |Estimated reading time: 2 minutes
Northbrook, Ill. — IPC — Association Connecting Electronics Industries has announced the technical conference sessions to be presented at its co-located IPC SMEMA Council's APEX/IPC Printed Circuits Expo/IPC Designers Summit exhibition and conference, taking place February 24 through 26, 2004, at the Anaheim Convention Center, in Anaheim, Calif.
With this year's all-inclusive format, the technical conference will welcome numerous global experts from every facet of industry's supply chain, including representatives from OEMs, EMS companies, suppliers, PCB manufacturers and the PCB design community.
The Technical Conference Program Committee carefully selected each of the more than 125 papers based on its ability to move industry forward through the latest technology or new process efficiencies to improve competitiveness. The 40 technical sessions will focus on Advanced Technology; Lead Free Technologies; Embedded Passives; Quality, Reliability and Testing; Design; PCB Fabrication; Assembly Processing; Materials; and Supply Chain/Business Issues.
Highlighted sessions of the three-day conference include:
- Advanced Technology: Flip Chip — This session will showcase the new technologies supporting the growing area of Flip Chip, including paste, underfill and underfill flux.
- Advanced Technology: High Frequency — Experts on materials, testing and design will share the latest in "pain-free innovation" for high frequency.
- Lead-free Assembly I, Lead Free Assembly II — Challenges from small components, new finishes, higher temperatures and different inspection criteria all face the user of lead-free. The first lead-free assembly session will concentrate on the actual assembly mechanisms in use today and the second will detail the actual processes of lead-free assembly, with special emphasis on repair, rework and reliability considerations.
- Embedded Passives: Materials and Processes — Papers in this session will focus on the new materials for Embedded Passives and the related processing techniques of this growing technology.
- Design I, Design II and Design III — Each of these three sessions will concentrate on today's design tools and practices. Following an overview in the first session, Design II will cover the new technologies for network modeling and generation, signal integrity analysis and microvia design rules. The final session will include papers on tools and technology and the latest in forward-thinking design practices.
- Fabrication Processes I, II and III — These three sessions will highlight the latest technologies that give today's fabricator a host of options when producing PCBs that meet the demands of today's products. The second session will cover microvias and Fabrication Processes III will detail chemistries, surface treatments and registration techniques.
- Continuous Improvement — A group of experts will assist companies in proactively optimizing their processes in times of reduced capital expenditures.
IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,200 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.