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SMTA Issues Call for Papers for SMTA International 2004
November 20, 2003 |Estimated reading time: 1 minute
Minneapolis — The SMTA International Technical Committee is seeking abstracts for this year's conference. Short course descriptions also are being solicited.
The abstract deadline is February 27, 2004, with acceptance by April 16 and manuscripts due by July 23. Papers should describe significant results from experiments; emphasize new techniques; and contain technical, economic or appropriate test data. Material should be original, unpublished and non-commercial in nature.
Paper are being solicited in the following categories:
- Emerging Technologies: System in a package, MEMS/RF MEMS/MOEMS, optoelectronics, wireless applications including Bluetooth and wi-fi, nanotechnology, 0201 components and assembly.
- Components: CSP including wafer-level packages, connectors, multichip packages including 3-D packaging, BGA, flip chip/direct chip attach, embedded passives, failure analysis, fine pitch technology, harsh environments (automobile, military, space), lead/termination finish, component solderability, component reliability, battery interactions.
- Assembly:Adhesives, BGA/CSP assembly, cleaning, DFX/design for Six Sigma, dispensing, equipment selection, facility layout, flux and solder, land pattern design, lead-free soldering, lean manufacturing, low volume/prototype assembly, medical electronics, printing, solder paste, placement, reflow soldering, rework and repair, selective soldering, set up reduction, supplier engineering, wave soldering, yield improvement.
- PCB Technology: Embedded passive components, HDI, microvias (filled and unfilled), soldermask, substrate reliability, substrate solderability, surface finish.
- Process Control: AOI, X-ray, test strategies, in-circuit test, CIM, software, process modeling.
- Business: Capacity modeling, contract manufacturing, design for success — remaining competitive, doing business in China, environmental issues, operations management, supplier management, total quality management, technology roadmaps.
To submit an abstract online, visit www.smta.org/smtai/call_for_papers.cfm