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IPC Honors Best Technical Paper at 2003 IPC Annual Meeting
October 13, 2003 |Estimated reading time: 1 minute
Northbrook, Ill. — IPC — Association Connecting Electronics Industries has announced the winner of the Best Technical Paper Award at the 2003 IPC Annual Meeting, which took place September 28 through Octiber 2 in Minneapolis, Minn.
"The Effect of Via-in-Pad Via-Fill on Solder Joint Void Formation," authored by Cookson Electronics' Adam Singer, Prashant Chouta and Eric Stafstrom, Creyr Innovation's James McLenaghan and Binghamton University's Guillermo Echeverria, received this year's Best Technical Paper Award. The paper was chosen for its in-depth analysis of how copper plating processes affect voiding levels in solder joints for via-in-pad printed circuit boards, addressing void size, frequency and location.
Stafstrom presented the paper at the 2003 IPC Annual Meeting and accepted a commemorative IPC plaque on behalf of his fellow co-authors.
In addition, IPC recognized the following two papers as honorable mentions: "Optimized System Design through Industry Benchmarking of Fabrication Tolerances and Material Properties," by Intel Corp.'s Gary Brist, Gary Long and Daryl Sato; and "The Study, Measurement, and Prevention of Tarnish on Immersion Silver Board Finishes," by Lenora Toscano and Donald Cullen, both of MacDermid Inc.
IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,200 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.