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Engent Announces Lead-free Deployment Solutions Program
October 1, 2003 |Estimated reading time: 1 minute
Atlanta — Engent Inc. has created a Lead-free Deployment Solutions Program.
The use of lead in electronics products has been considered an environmental issue and is beginning a "phase out" in different parts of the world. Japan is leading the way with major Japanese corporations committing to eliminate the use of lead in electronic products by 2005. In addition, the European Union has set legislation into motion that mandates the use of lead-free materials in all electronic and other products by July 2006.
The elimination of lead in electronic products will require new materials and processes to be put into use. Engent will be partnering with multinational and regional OEMs, EMS providers and materials suppliers to study the properties and processing of new materials that do not contain lead and deliver a solution to these emerging mandates.
Engent's program defines a complete lead-free process, including design considerations, solder paste, printing, placement and reflow process procedures as well as the deployment of the process technology around the world. Engent is currently seeking additional partners to participate in this deployment and share in the overall results.
Engent Inc. is a provider of advanced technology services. Engent's Advanced Assembly Technology (AAT) Center is an 11,000 sq ft facility, including a Class 10,000 clean room and more than 60 pieces of analytical and manufacturing equipment. For more information, visit www.engentaat.com.