IPC TMRC Meeting Considers Potential for Wireless Infrastructure in North American Interconnect Industry


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Northbrook, Ill. — IPC — Association Connecting Electronics Industries announces the schedule for its fall Technology Market Research Council (TMRC) Meeting, taking place October 1 through 2, 2003, at the Minneapolis Convention Center in Minneapolis, Minn., in conjunction with the 2003 IPC Annual Meeting.

The Telecommunications Industry Association recently projected that wireless communications spending in the U.S. would grow by 9.6 percent annually through 2006, reaching $164.5 billion. With this data in mind, IPC will focus the TMRC Meeting on the infrastructure and backbone of telecommunications and examine the wireless technologies that hold significant promise for the North American printed circuit board (PCB) and electronics assembly industries.

Robert Shrouds, corporate economist at E.I. Dupont de Nemours and Co., will open the two-day conference with a macro look at the business economy. Shrouds, who was recently recognized by The Wall Street Journal, along with his fellow DuPont associate Robert Fry, for exceptional forecasting of the U.S. economy's strong growth rate and the changes in various economic indicators, will discuss the current state of the economy and provide his insight into the electronic interconnect industries.

Then, Walt Custer, president of Custer Consulting Group, will further examine how growth in the wireless market spells hope for the North American market, with a microeconomic look into the specific expectations for electronics assembly and PCB sales.

Throughout the next four segments, IPC's TMRC meeting will then shift its focus to a deeper analysis of the wireless market, in particular regard to its relevancy to a manufacturing, supplier or assembly company.

Claudia Bacco, president of TeleChoice Inc., will begin the discussion with an examination of the wireless infrastructure, and Phil Plonski, managing partner at Prismark Partners, will describe wireless network technologies and how they relate to the PCB and EMS industries.

Along this same vein, Donald Willis, corporate vice president and director of strategic business development, global telecom solutions sector for Motorola, will provide a broad OEM perspective of wireless infrastructure, while Frank Sanders, Intel Corp.'s PCB materials manager, will translate that perspective into requirements for the PCB industry.

Day two of the fall TMRC Meeting will begin with new Technology Spotlights, which feature more technical-focused presentations. Michael Freda, interconnect specialist for Sun Microsystems, will open the first spotlight with a discussion on the significant opportunities and technical challenges for North American manufacturers in the wireless infrastructure. George Dudnikov, senior vice president and chief technology officer for Sanmina-SCI Corp., will then follow Freda's presentation with a discussion on the advanced technology trends for broadband access.

Next, Susan Johnson, vice president of test for Pemstar, will share her views on "Trends for Test in the EMS Environment: Telecommunications, Medical and Military" and Barry Gilbert, Ph.D., director and head of Mayo's Specialty Purpose Product Development Group, will examine cutting-edge interconnect and packaging technology trends for medical and military applications.

This year's schedule will also see the reintroduction of Company Spotlights, a segment showcasing particular electronic interconnect industry companies. Bonnie Fena, president of Reptron Manufacturing Services/Hibbing, and Benoit Pouliquen, CEO of Sheldahl Inc., will conclude the fall TMRC meeting with brief overviews of their Minnesota-based companies.

IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,300 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.

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