Reading time ( words)
Northbrook, Ill. — IPC — Association Connecting Electronics Industries announces a call for participation in its inaugural National Conference on Electronic Packaging for Homeland Security, which takes place October 14 through 15, 2003, in Gaithersburg, Md.
Given the unpredictability of world events, the issue of homeland security has never been more important. The federal government is searching for innovative, cutting-edge products that will provide protection from future attacks, and the U.S. electronics industry is in an excellent position to provide the necessary resources and tools. Consequently, IPC has launched this new conference to keep industry aware of the emerging advancements and issues involved in this market.
The National Conference on Electronic Packaging for Homeland Security will offer 30- to 45-minute time slots for papers and presentations in both forum or panel discussion formats. IPC is currently seeking papers from the following areas:
- Design Considerations — miniaturization, high performance and component issues
- Material and Equipment Issues — reliability, attachment, materials and thermal management
- Packaging Issues — long-term storage and high density
- Systems Level and Manufacturing Issues — harsh environment considerations, outsourcing and implications of lead free
- Applications for High-Reliability Military and Spaceborne Systems — surveillance and parts monitoring
- Related Applications — biometrics, nanopackaging and wireless computers
Presentation materials and papers should be noncommercial in nature, focusing on technology. To deliver an oral presentation, it is mandatory to provide a print-quality paper or hard copies of visuals for the conference proceedings. Previously published papers and presentations focused on a company's products will not be accepted.
Abstracts summarizing original and previously unpublished work and covering case histories, research and discoveries must be received by August 22, 2003. The abstracts should be approximately 200 to 300 words long and include a brief biography. If an abstract is accepted, the deadline for paper submissions will be September 19, 2003. IPC also invites companies to showcase their products and services at the conference.
IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,300 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.