IPC Offers Second Glimpse Into Future

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Northbrook, Ill. — IPC — Association Connecting Electronics Industries will hold a second free webcast, sponsored by General Electric, to discuss additional segments of the 2002-2003 IPC National Technology Roadmap for Electronic Interconnections on Thursday, August 21, 2003, from 11 a.m. to noon, CST.

In January 2003, IPC held an initial webcast, providing a high-level overview of the Roadmap and discussing certain sections that address Technology Emulators, Printed Circuit Board (PCB) Fabrication, PCB Assembly, Optoelectronics and Roadmap Verification.

During this follow-up presentation, Dieter Bergman, IPC director of technology transfer, and Jack Fisher, principal consultant at Interconnect Technology Analysis, will delve into sections of the Roadmap that focus on Backplanes and Electronic Packaging of components. Additionally, an update will be provided on activities underway to make the IPC Roadmap a living document. Two major OEMs have already provided a critique of the 2002-2003 document and the Roadmap committee is working to incorporate that critique.

The 2002-2003 IPC National Technology Roadmap for Electronic Interconnections analyzes the needs of original equipment manufacturers (OEMs) in the coming decade and how these needs translate to PCB requirements. The predictions in the Roadmap are based on forecasts by dozens of major OEMs.

All participants must pre-register for the free webcast at www.ipc.org. Once registered, participants will be able to log online, view and listen to the presentation and participate during a question-and-answer session, all from the convenience of their desk or conference room.

IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,500 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.



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