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SOLDERTEC Global Requests Applications, Nominations for Lead-free Solder Awards 2003
July 23, 2003 |Estimated reading time: 1 minute
UK — SOLDERTEC is offering individuals or organizations involved with development of lead-free technology the opportunity to apply for one of this year's Lead-free Solder Awards.
The awards recognize significant contributions of researchers, engineers or companies to the development and implementation of lead-free electronics soldering during 2003. Applications can be made directly by individuals or organizations, but industry is also encouraged to provide nominations of individuals they feel should be recognized through this award.
Applications or nominations should be made by email to tom.perrett@tintechnology.com, describing in 300 words or less the work of the individual towards achieving the successful introduction of lead-free electronics. Past awards have been made for leading collaborative research projects, introducing lead-free soldering into production, making particular improvements in process technology or contributing to knowledge through academic studies. Details of previous award winners can be found below.
The deadline for application is October 17, 2003, and winners will be announced in November 2003.
The Soldertec award was established in 1999 to mark the launch of Tin Technology's Lead-free Soldering Centre (Soldertec) and was granted in its first year to Kenichiro Suetsugu, Ph.D., of Panasonic, Japan in recognition of the successful introduction of lead-free soldering in mass production of the portable MiniDisc SJ-MJ30-S.
Past winners include:
- 2000: James Vincent, Ph.D., of Marconi, for his work as project leader of the European based IDEALS collaborative program and Prof Tadatomo Suga, Tokyo University, for his leadership of the Japanese NEDO lead-free project.
- 2001: Professor Suganuma, Osaka University, for his contribution to the understanding of lead-free materials through continuing research activities, and to Carol Handwerker, Ph.D. of NIST U.S., in recognition of her efforts as a key participant of the NCMS project and her involvement in the NEMI lead-free program.
- 2002: Dongkai Shangguan, Ph.D., director of advanced process technology, Flextronics US and previously of Ford/Visteon; David Bergman, vice president of standards, technology and international relations, IPC — Association Connecting Electronics Industries; and the Lead-free Component Focus Group, chaired by Mark Kwoka of Intersil, and with core group members; L Whiteman (ACI), J Cannis (Amkor), G O'Brien (Photocircuits), D Hillman (Rockwell Collins), M Toben (Shipley Ronal), and R Schetty (Technic).
These winners reflect a range of activities on lead-free soldering from industrial roadmapping and leadership, to detailed technical studies
For more information on SOLDERTEC or the awards program, visit www.lead-free.org.