Universal Teams with CALCE to Enhance Packaging, Assembly Analysis

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Binghamton, N.Y. — Universal Instruments Surface Mount Technology Laboratories and the CALCE Electronic Products and Systems Center (EPSC) at the University of Maryland have agreed to cooperate on research projects into reliability and manufacturability in packaging and assembly.

Work is expected to focus on interconnect reliability and techniques for lead-free manufacturing.

Universal expects the results of the cooperation to be particularly important to its manufacturing services customers, who provide increasingly high-level services with the blurring of the traditional distinctions between OEM and EMS.

For more information on Universal Instruments Corp., visit www.uic.com.



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