IPC Leads Expedition Through Exotic Interconnections, Advanced Process Capabilities


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Northbrook, Ill. — IPC — Association Connecting Electronics Industries has announced the technical conference sessions to be presented Tuesday, September 30 through Wednesday, October 1, at the 2003 IPC Annual Meeting, which takes place at the Minneapolis Convention Center in Minneapolis, Minn.

This year's national technical conference, entitled "Exotic Interconnections and Advanced Process Capability," will explore the jungle that is today's electronics interconnect marketplace. The 41 papers will better explain how to slash lead times, improve quality, increase production capacity and innovate. Vendors and OEMs will present their perspectives on cost modeling and validation of benchmarking tools through actual case studies and industry experts will divulge the latest data on board finishes, liquid crystal polymers and exotic interconnects.

Highlights of this year's technical conference include all-new sessions on statistical benchmarking, the latest in multi-chip packaging and a panel discussion on AOI/AXI inspection technologies.

The Benchmarking and Process Capability session, led by Dave Wolf, CAT Inc., will examine how statistical benchmarking can target specific barriers to yield improvement and increased capability by analyzing the available tools and case studies.

The latest in multi-chip packaging, such as System-in-Package (SiP) and stacked/folded die CSP, which offers measurable board real estate savings will be scrutinized in the Exotic Interconnections section. Stephen Pierce, SGP Ventures Inc., and fellow North American and Japanese experts will share current technology enablers for allowing multiple substructures to be electrically connected, while still maintaining small footprints.

Amit Verma, Teradyne, will chair the panel on Automated Inspection Systems in electronics manufacturing. Industry experts will present technical data on the benefits of implementing AOI and AXI machines, such as the improvement of defect coverage, loss of electrical and visual access, inspection repeatability, and continuous improvement strategies.

Other sessions included in this year's technical conference will cover the principles and philosophies of printed circuit board design; reveal the challenges within the electronics manufacturing services industry; explore embedded passive components; present the latest information on high-speed and high-frequency circuit design and materials; provide updates on the latest advancements in cutting edge technology; and unveil the latest reports on new immersion finishes offering superior co-planarity and capability.

IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,300 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.

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