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News
December 31, 1969 |Estimated reading time: 13 minutes
Compiled By SMT Staff
NEMI Launches DPMO Project
HERNDON, Va. — The National Electronics Manufacturing Initiative (NEMI), an industry-led consortium focused on strengthening the North American supply chain, launched a project aimed at benchmarking defects per million opportunities (DPMO) rates for printed circuit board (PCB) assemblies.
The project team plans to assemble DPMO data by package and technology type in an effort to help manufacturers benchmark their own relative quality performance.
The project is a spin-off of NEMI's recently completed Test Strategy Project, which was chaired by Amit Verma of Teradyne. Recognizing that there was additional work on which NEMI members could collaborate beyond the scope of the initial Test Strategy Project, Verma initiated efforts to organize the DPMO project.
Leading the newly formed project with Kruse is co-chair David Mendez of Solectron Corp. The project currently has 15 participants: Agilent Technologies, Alcatel Canada, Celestica Inc., Delphi Delco Electronics Systems, Georgia Institute of Technology, Hewlett-Packard Co., Motorola Inc., Nortel Networks, Plexus Corp., Sanmina-SCI, Shipley Co., Solectron Corp., Teradyne Inc., Universal Instruments Corp. and Vitronics Soltec.
IPC, HKPCA Co-create International Exhibition
NORTHBROOK, Ill. — IPC — Association Connecting Electronics Industries and Hong Kong Printed Circuit Association (HKPCA) will co-produce the International Printed Circuit and Electronics Assembly Fair from December 10 through 12, 2003, postponed from September 17 through 19 due to the SARS.outbreak, at the Guangzhou Inter-national Convention Center in China. The inaugural event serves the PCB and electronics assembly industries.
HKPCA, which produced a successful exhibition in Dongguan, China, in 2002, and IPC, which has produced many events, including IPC Printed Circuits Expo and IPC SMEMA Council's APEX, will draw from their years of experience in trade show development to create an exhibition that is cost-effective, focused and fair for exhibitors.
The International Printed Circuit and Electronics Assembly Fair has gained the support of the U.S. and Chinese governments. IPC and the U.S. Department of Commerce will conduct an official trade mission to China and a visit to the conference and exhibition. Additionally, the Guangzhou government has assigned the Guangzhou Economic and Technology Development District Administrative Committee and the China Council for the Promotion of International Trade Guangzhou Subcouncil to assist in the successful production of the show.
Both organizations plan to collect world-class speakers for a dynamic technical conference that covers board design through manufacture and electronics assembly through test, and produce a full schedule of half- and full-day educational courses designed for local engineers and technical professionals.
PCB BOOK-TO-BILL RATIO
Book-to-Bill Dips After Four Months of Increases
NORTHBROOK, Ill. — The IPC PCB book-to-bill ratio for April was 0.97, meaning $97 worth of orders for new boards were received for every $100 billed (shipped). The ratio decreased from the March level of 1.04. Sales billed (shipments) in April 2003 decreased 29.5 percent from April 2002, and orders booked decreased 32.6 percent from April 2002. Compared to 2002, PCB bookings are down 22.9 percent YTD, while PCB shipments are down 25.8 percent YTD.
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April's book-to-bill level decreased from March's numbers, while orders booked for April 2003 decreased 32.6 percent below the level in April 2002.
Q & A: implementation challenges of Lead-free solder in Flip Chip and CSP Applications
Q: Our company has been producing underfilled flip chip-on-board and CSP assemblies for the past few years with good success. With pending regulations and the emerging demand for lead-free electronics, we are looking into implementing lead-free solder for our flip chip devices. What are some factors that need to be considered when launching a lead-free flip chip or lead-free CSP product?
A: It is important to note that a shift to lead-free soldering is not a drop-in process. Before starting this type of project, it is important to note several of the key considerations for the process: lead-free alloy selection, flux, underfill and thermal profiling, to name a few.
The selection of solder is especially critical with flip chip and CSP, where the solder plays an amplified structural role. A drop-in replacement to eutectic SnPb is no longer expected to appear as the global "standard" alloy. However, consumer electronics companies outside Japan seem to have agreed on the SnAgCu systems, with the alloying elements ranging from 3.0 to 4.7 percent Ag and 0.5 to 3.0 percent Cu. The melting temperature of the various alloy compositions do not vary much; they are between ~217° and 221°C. The stipulation of higher peak reflow temperatures will significantly impact the flux and flux residue.
The materials that provide the most consistent yields and the highest reliability when processing flip chips and CSPs are those fluxes that have the lowest amount of residue without decomposing during the elevated reflow temperatures, causing interconnect yield loss. Optimization of the flux amount is important because interconnect formation can be inconsistent at elevated reflow temperatures required for lead-free solders. Excessive flux adversely affects reliability due to residues and underfill compatibility. With the lower surface energies of lead-free solders, insufficient flux amounts can lead to opens and/or poor solder joint formation.
The reliability of flip chip and CSP devices is highly affected by the flux/underfill compatibility. Studies show that incompatibility of a flux/underfill combination results in a loss of adhesion, which in turn accelerates the cyclic fatigue due to the CTE mismatch. Particular attention should be paid to selection of compatible fluxes that can survive the elevated lead-free reflow profiles required.
The level of underfill adhesion to all surfaces in the flip chip and CSP system is what dictates reliability of the assemblies. This includes the solder mask, exposed bare board, solder, chip passivation and any flux residues that may be present. In the case of lead-free solders, there is a need to examine the difference in underfill adhesion as compared to the known good adhesion to SnPb alloy joints. The elevated reflow temperatures can cause further breakdown and decomposition of the flux chemistry leading to residues that are not soluble in liquid underfills. The ultimate effect is loss of underfill adhesion surrounding the solder interconnect, propagation of delamination, and the rapid fatigue failure of the solder interconnects.
For lead-free soldering, reflow profiling is critical for developing a temperature profile that allows robust solder interconnect formation yet also keeps as low a peak temperature as possible. The liquidus temperature of the lead-free alloy used for flip chip and CSP assembly is ~217°C to 221°C. In contrast, the liquidus temperature of 63Sn-37Pb is 183°C — a 34°C difference. In the beginning it will be important to closely monitor this phase of the process and ensure the reflow process maintains a Cpk value of 1.33 or higher with respect to the key reflow profile variables of peak temperature, time above liquidus, soak time, soak temperature, and ramp rate based on the selected flux and solder paste materials.
Daniel F. Baldwin, Ph.D. is the president of Engent Inc., Norcross, Ga.
Cavallaro Launches Company
NEWBURY, Mass. — Ken Cavallaro, former president of Camelot Systems Inc., launched Riverview Partners Inc., a strategic business development consulting company.
Riverview Partners is an entrepreneurial consulting and strategic business development company focused on building companies. Riverview works with small growing companies by helping to identify market opportunities and building a strategic plan to accomplish their goals.
One product featured by the new company is a "technology assessment," which is an independent analysis of technology and/or products. For more information on Riverview Partners, visit www.riverviewpartners.com.
UIC Continues Commitment to China
BINGHAMTON, N.Y. — Universal Instruments Corp. (UIC) continues its commitment to China with the opening of a manufacturing facility in Shekou, Guangdong Province.
The state-of-the-art 4,700 sq m manufacturing facility will act as a base to service the company's Asian business and provide hands-on process and manufacturing training support for existing and potential customers in China. Additionally, the facility will house research, engineering and finance, as well as product assembly.
The company sees this facility as an investment in the future. Asian sales already represent more than 50 percent of the company's global revenues, according to UIC.
The opening of the facility and the launch of the company's mid-range machines heralds a change in its approach to the market. UIC will appoint more representatives to assist entry into the mid-range market in China.
NEPCON West Postponed Indefinitely
NORWALK, Conn. — NEPCON West, Assembly West and Fiberoptic Automation Expo 2003, scheduled for October 28 through 29, at the San Jose McEnery Convention Center in San Jose, Calif., have been postponed indefinitely.
These three events first co-located in December 2002 in San Jose. Facing the continued recession in the electronics manufacturing industry, coupled with the trend for OEMs to outsource manufacturing and the migration of the electronics manufacturing industry to China, Reed Exhibitions stated that events reflect the markets they serve and at this time the Northern California market is not strong enough for NEPCON West to provide the return on investment desired by exhibitors.
The NEPCON events feature leading suppliers displaying a full range of electronics manufacturing solutions, from adhesives and advanced microelectronics to test equipment, rework, wire and cable assembly. For more information, visit www.nepcon.com.
ZESTRON Stencil Test Compatibility Results
ASHBURN, Va. — Stencils from various stencil manufacturers were recently tested for compatibility with ZESTRON and VIGON cleaning agents. Stencils from Acumen, Beam On Technology, CAD-Tech, Chepaume, Fineline, Hybrid Integrated Services, MRC, Photo Stencil, Stentech and UTZ were tested extensively in the company's technical center and were proven to be fully compatible with the cleaning agents. Tests were performed in accordance with ZESTRON's Standard Stencil Compatibility Test methods in regular stencil cleaning equipment (200 cleaning cycles, 15 minutes each).
To obtain a copy of the test results, contact the company at (888) 999-9116.
Engent Acquires Siemens AAT Center Rights
ATLANTA — Engent Inc. and Siemens Dematic Electronics Assembly Systems Inc. (EAS) signed an agreement allowing Engent to assume rights to the Advanced Assembly Technology (AAT) Center contracts, equipment and personnel located in Norcross, Ga.
Additionally, Engent will become a member of the newly formed Siemens Dematic Technology Network, and the two companies will work together to provide advanced technology solutions to the electronics industry. Leading the effort for Engent is Daniel F. Baldwin, Ph.D., president.
March Reports Growing Plasma Market
CONCORD, Calif. — March Plasma Systems reports increased industry interest in plasma treatment for PCB manufacturing. Worldwide sales volume was up significantly in this first quarter over last quarter 2002. Future project activity is running at high double-digit rate increases over previous periods.
To further strengthen its position in the PCB marketplace, March named Dennis McGee as their global PCB market manager, and Dave Selestak as eastern U.S. regional sales manager. Newly added PCB representative firms have been appointed in both the United States and Asia, recognizing their in-depth knowledge of PCB manufacturing and complementary product lines. Other activities include participation at the CPCA show in Shanghai, China, in mid-March and the IPC tradeshow that immediately followed in Long Beach, Calif.
Router Solutions, PCB CAM Solutions Partner
NEWPORT BEACH, Calif. and WIMBORNE, Dorset, England — Router Solutions Inc. (RSI), a provider of software technologies used in ECAD interface from design through manufacturing, and PCB CAM Solutions Ltd. (PCS), an ECAD and manufacturing solutions provider, have formed a partnership agreement that established PCS as RSI's exclusive representative in the United Kingdom and Ireland.
In a joint statement by Dino Ditta, RSI president, and Ian Brown, managing director of PCS, the companies confirmed their commitment to providing customers with focused, efficient support within their U.K. and Irish markets.
BRIEFS
DEK Adds New Capability
DEK added stencil design and manufacturing capability to its new logistics hub at Memphis, Tenn., to enhance support for North American customers of its Process Support Products division. The Memphis site also distributes consumables, machine performance upgrades, dedicated tooling and machine spares to all North American customers.
Electronic HSP Support Available
Software support services for Universal Instruments' HSP (chipshooter) products have been added to the company's Web site, located at www.uic.com. This software service is designed to provide quick turnaround for new releases and machine updates, while maintaining the most efficient distribution method possible. A software revision "notes and known issues" area provides information on the latest changes and conditions associated with machine software levels.
Asymtek Receives Research Rating
Asymtek received the Factory Mutual Research Rating for their Century C-740 and C-741 selective conformal coating systems, ensuring the highest safety standards for its customers and employees. Factory Mutual Research, managed by Factory Mutual Global, is a non-profit scientific and testing organization that has tested and certified more than 40,000 products in the last 165 years, and helps businesses put safe products into local, national and international markets.
BAE SYSTEMS Selects Cogiscan
Information and Electronic Warfare Systems, a unit of BAE SYSTEMS North America, installed Cogiscan's MSD Control System in their Nashua, N.H., facility for circuit card assembly. The system tracks the exposure history of each moisture-sensitive device from the time the seal is broken on the moisture barrier bag until the mass reflow operation is complete. The system is expected to reduce repair and rework of damaged parts at BAE SYSTEMS while improving product quality and cycle time.
ENVIRONMENTAL UPDATE
Frequent Lead-free Questions Answered
MIDDLESEX, United Kingdom — The National Physical Laboratory launched a link to its Web site, located at www.npl.co.uk/ei/news/faqs.html, called "All you want to know on lead-free." This tool is in the form of answers to the most often asked questions regarding the subject of lead-free soldering. Visiting the site not only provides answers, but also additional links that will aid in the change to meet legislation that will be implemented in 2006.
Questions range from legislation, exemptions, status on imported products, alloy choice, process temperatures required, hand soldering and rework issues, reliability, process requirements, inspection criteria, need for cleaning, sourcing of lead-free components and PCBs, costs, retraining, and more.
The additional links include further reading on WEEE, RoHS and end-of-life (EOL) directives. Also, references to NPL's practical experiences over many years in processing lead-free assemblies, including inspection, solderability and reliability tips are available.
Clarification
In the May issue of SMT Magazine, on the Inside Line news page (page 4), QTS Inc.'s dateline was stated incorrectly. The company's correct location is East Walpole, Mass. Feel free to contact QTS Inc. at www.qtsframe.com for more information on the Wizard Frame System.
NEWSMAKERS
People Süleyman Tasçilar
Cobar Europe, Breda, Holland, appointed Süleyman Tasçilar as applications engineer. In his new position, Tasçilar will be responsible for assisting the company's customers with their process development needs in all types of soldering areas from specifying the right solder paste formulations for specific applications to lead-free soldering implementation, wavesolder fluxing, hand soldering, selective soldering and more.
San Jose, Calif.-based Photon Dynamics named Jeffrey Hawthorne the company's new senior vice president to manage the flat panel display business. Hawthorne most recently was president of the Image Processing Systems Division and replaces Bernard T. Clark.
Resistor manufacturer TT electronics IRC Wire and Advanced Film Div., Boone, N.C., appointed Don Bolster TRESCO general manager. TRESCO is a stocking master distributor for more than 16 international electronic component and hardware manufacturers and makes their on-the-shelf components available to more than 2,000 industrial and MRO distributors in the Americas and overseas.
Professor Andreas Moebius, Ph.D., has been appointed R&D Fellow by Enthone Inc., a Cookson Electronics PWB Materials & Chemistry business, West Haven, Conn. Moebius is responsible for identifying and evaluating new technology opportunities to further strengthen and grow the company's technology portfolio.
Benoit Ouellet
Quebec, Canada-based Cogiscan Inc. named Benoit Ouellet as software engineering manager for their line of material tracking and control systems. Ouellet is responsible for the software development group, as well as software quality at the company's Quebec headquarters.
Companies
Adhesives Research Inc., Glen Rock, Pa., signed an agreement with Techno Alpha Co. Ltd. to serve as sales agent/distributor in Japan for the company's electronics and industrial technologies. In addition to representing the company's product line, Techno Alpha will advertise Adhesives Research's products in Japanese trade journals and magazines and participate in relevant Japanese trade shows.
Grand Junction, Colo.-based GPD Global formed an alliance with Altus Group, a U.K. distribution company. Altus Group is GPD's new sales representative for the United Kingdom and Ireland, offering customer support in the electronics assembly and high-density interconnect industries.
Cooper Bussmann's Paul P. Gubany Center (high-power testing) and Product Development Center (low-power testing), St. Louis, now offers DC power short-circuit testing up to 100,000 A, over a voltage range of 100 to 1,000. Applications include telecommunications products, uninterruptible power supplies and any DC photovoltaic uses.