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Nextek Expands Production Operations
June 26, 2003 |Estimated reading time: Less than a minute
Madison, Ala. — Nextek Inc. has expanded its production operations to meet increasing customer demand.
Additional state-of-the-art automated surface mount assembly equipment has been installed to provide expanded capacity for advanced technology printed circuit assemblies using BGA, CGA and CSP packaging as well as standard SMT. The additional capacity, combined with the ability to handle to any type of surface mount package will assist the company in servicing all of its customers.
Additional dispense and ultraviolet cure equipment was also installed in the company's Class 10,000 clean room to address the increasing demand for microelectronic and optoelectronic assembly of fiber optic transceivers and medical devices.
The company provides product realization services to OEMs employing advanced technology interconnect, process and material technologies, and specializing in New Product Introduction (NPI) and accelerating time-to-market.
Nextek Inc. is a niche market, technology-driven company, focused on offering precision electronic and optoelectronic assembly and engineering services for customers with needs-driven, non-commodity products. For more information, visit www.nextekinc.com.